Lates News

The semiconductor foundry TSMC continues to invest in advanced processes and advanced packaging facilities. A media tour event is expected to be held in Chiayi on January 22, which will be the first time TSMC Chiayi advanced packaging and testing factory 7 is open to the media. TSMC Chairman and CEO Mark Liu emphasized at a recent investor conference that TSMC is preparing for multiple 2-nanometer wafer fabs in the Hsinchu and Kaohsiung Science Parks and will continue to invest in advanced processes and packaging facilities in the coming years. (Taiwanese media "Commercial Times")