DELI Laser: The company has completed the shipment of panel-level glass substrate via hole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology.

Diel Laser answered the investors' questions on the interactive platform on the 14th, stating that the company has completed the shipment of panel-level glass substrate perforation equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology.