Shanghai Lingang New Area has launched the project for the advanced packaging and testing base of digital light source cores to promote the main light source chip supply chain.

On December 25th, 2025, the "Advanced Packaging and Testing Base Project for Digital Light Source Chips" officially started construction in the Lingang New Area. The project was selected as the first phase investment of 300 million yuan in Shanghai's major engineering projects, focusing on the field of Micro-LED integrated automotive light source chips, which will effectively promote the domestic substitution process of high-end automotive light source chips. The relevant person in charge of the Lingang New Area revealed that the "Advanced Packaging and Testing Base Project for Digital Light Source Chips" covers a total area of 35 acres, and is expected to be completed in the first half of 2027. Once completed, it will have an annual production capacity of 1.2 million Micro-LED light source chips and 600,000 sets of car lamp modules. The products have technological advantages such as independent pixel control and microsecond response, meeting the industry's demand for intelligent interactive lighting. At the same time, the Advanced Packaging and Testing Base for Digital Light Source Chips will strive to break through the research and manufacturing bottlenecks of international new technology Micro-LED integrated automotive light source chips, targeting the key links in the automotive main light source chip supply chain monopolized by foreign manufacturers.