TELD Laser: Prototype of ultra-fast laser drilling equipment is currently under development.

On November 7, Deir Laser stated on the interactive platform that the company's TGV laser micro-hole equipment has completed the shipment of panel-level glass substrate via holes, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology. The company's PCB business mainly focuses on the development of ultra-fast laser drilling technology, and has already been connected with 2 to 3 customers. Currently, the prototype of ultra-fast laser drilling equipment is under trial production.