The public service platform for reliability testing of chip manufacturing and packaging established by Wuchuang Institute is unveiled.

The ACCON2025 high-end chip industry innovation and development conference is being held in Wuhan today. At the conference, Wuhan Innovation Academy announced the establishment of a chip manufacturing and packaging reliability testing public service platform. The first batch of ecological cooperation partners includes Wuhan New Xinchip Integrated Circuit Co., Ltd., Wuhan Feien Microelectronics Co., Ltd., High-end Chip Innovation Development Alliance, Hubei Jiangcheng Laboratory, Wuhan Chuangxin Technology Co., Ltd., and Vector Group.