New Stock Debut | Chipmore Semiconductor (07672) Lists on First Day, Opens 20.5% Higher in Early Trading; Company Focuses on Advanced Semiconductor Packaging and Testing Technology Solutions

Chipmore Semiconductor (07672) debuted on its first trading day. According to the announcement, the offer price was HK$8.88 per share, with a total of 106,562,500 shares issued, at 500 shares per lot, and net proceeds of approximately HK$904 million. As of press time, the stock rose 20.5% to HK$10.7, with turnover of HK$89.9624 million. According to the prospectus, Chipmore Semiconductor is a semiconductor packaging and testing service provider principally engaged in developing packaging designs, providing customized packaging products, and offering packaging product testing services. According to Frost & Sullivan, in the "post-Moore era" where transistor density growth is approaching its scale limit, relying on novel semiconductor packaging architectures as a key link connecting chip design and applications has become the key DRIVE for improving chip performance, efficiency, and functional flexibility. Since its establishment in September 2020, the Group has expanded into both traditional and advanced packaging fields, accumulated packaging technology knowledge, and possesses mass production capabilities for both traditional and advanced packaging, covering packaging products such as QFN, BGA, LGA, WLP, and 2.5D/3D. The Group has established the "Chiplet and Advanced Packaging Technology Platform (CAPiC)" covering all technology branches in both traditional and advanced packaging fields to advance the Group's technical knowledge and continuously develop new technologies.