New Stock News | Xinde Semiconductor's Hong Kong IPO and Full Circulation of Domestic Unlisted Shares Filed with the CSRC

On September 18, the International Cooperation Department of the China Securities Regulatory Commission issued the "Notice of Filing for Overseas Issuance and Listing and Full Circulation of Domestic Unlisted Shares of Jiangsu Xinde Semiconductor Technology Co., Ltd." The company plans to issue no more than 367,640,500 overseas listed ordinary shares and list on the Hong Kong Stock Exchange. The company's 51 shareholders plan to convert a total of 693,909,187 domestic unlisted shares they hold into overseas listed shares and list them for trading on the Hong Kong Stock Exchange. According to the prospectus, Xinde Semiconductor is a semiconductor packaging and testing technology solutions provider, mainly engaged in developing packaging design, providing customized packaging products, and packaging product testing services. The company is one of the enterprises in China with advanced packaging technology capabilities, able to promote breakthroughs in innovative semiconductor technologies in the "post-Moore era" and support the development wave of the "AI+ era." Since its establishment in September 2020, Xinde Semiconductor has expanded into the advanced packaging field, accumulated packaging technology experience, and possesses mass production capabilities for advanced packaging, covering QFN, BGA, LGA, WLP, and 2.5D/3D, among others. The company is one of the few advanced packaging product providers in China among the first to gather all of the above technical capabilities. The company has established the "Chiplet and Advanced Packaging Technology Platform (CAPiC)" covering all technical branches in the advanced packaging field to advance the company's technical knowledge and continuously research and develop technology.