Huatai (06886): "25Huatai Sci-Tech Innovation Bond 01A" will pay interest on September 22.

date
20:56 15/09/2026
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GMT Eight
Huatai Securities (06886) issued an announcement. To ensure the smooth progress of the interest payment work for Huatai Securities Co., Ltd. 2025 Sci-Tech Innovation Bond (First Tranche) (Type One) (bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, bond code: 342580006.IB), and to facilitate investors in receiving interest payment funds in a timely manner, the relevant matters are hereby announced as follows: Bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, total issue amount: RMB 300 million, bond interest rate for this interest calculation period: 1.66%, interest payment date: September 22, 2026.
Huatai (06886) issued an announcement stating that, to ensure the smooth progress of the interest payment for Huatai Co., Ltd. 2025 Sci-Tech Innovation Bond (First Tranche) (Type I) (bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, bond code: 342580006.IB) and to facilitate investors in receiving interest payment funds in a timely manner, the relevant matters are hereby announced as follows: Bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, total issue amount: RMB 300 million, interest rate of this interest calculation period: 1.66%, interest payment date: September 22, 2026.