Ingenic Semiconductor (03223) will conduct an IPO from August 17 to August 20, introducing cornerstone investors such as Emerald Prime and GF Fund.

Ingenic Semiconductor (03223) will conduct an initial public offering from August 17, 2026, to August 20, 2026. The company plans to globally issue 31,287,300 H shares, of which 10% will be offered in Hong Kong and 90% internationally, along with an over-allotment option of 15%. The maximum offer price per share will not exceed HKD 102.8. Each lot will consist of 100 H shares, and the H shares are expected to begin trading on the Hong Kong Stock Exchange at 9:00 AM on August 25, 2026 (Tuesday). The company operates under a fabless model, focusing on chip research and development, while collaborating with leading foundries and semiconductor packaging and testing service providers to ensure scalability. Through organic growth and strategic acquisitions, the company has become one with a comprehensive product portfolio. According to Frost & Sullivan, the company holds a leading position in key global markets, continuously empowering the development and innovation in cutting-edge technology fields such as automotive electronics and edge computing. In 2023, 2024, 2025, and for the three months ending March 31, 2026, the company's R&D expenses were RMB 708.3 million, RMB 681.3 million, RMB 712.0 million, and RMB 171.9 million, representing 15.6%, 16.2%, 15.0%, and 11.0% of the company's total revenue for the respective years/periods. The company has entered into cornerstone investment agreements with Emerald Prime, GF Fund, Perseverance Asset Management, Shanghai Gao Yi, and Huatai Capital Investment (related to Huatai's total return swap and client total return swap), Singapore Huaqin, ICBC Wealth Management, Arrow Target, Huatai-Tianfu (Hong Kong), Singularity Asset, Heading Pioneer 10 Fund LPF, and Dreamee HK Fund, wherein the cornerstone investors have agreed to subscribe or procure their designated entities to subscribe for the relevant number of offered shares at the offer price, subject to certain conditions (rounded down to the nearest complete trading unit of 100 H shares), with a total amount of approximately USD 192 million. Assuming the maximum offer price is HKD 102.80 per share, the company estimates that it will receive a net amount of approximately HKD 3.1412 billion from the global offering after deducting the underwriting commission and other estimated expenses related to the global offering (assuming the over-allotment option is not exercised). The company plans to use the proceeds for the following purposes: Approximately 50.0% will be used to enhance technology innovation and product development in its three core product lines (memory chips, computing chips, and analog chips). Approximately 25.0% will be allocated for strategic investments and/or acquisitions to seize growth opportunities. About 15.0% will be used to expand the company's network and promote its products. Approximately 10.0% will be reserved for working capital and other general corporate purposes, including daily operations and general corporate expenses.