Sinolink: Accelerated industrialization progress of diamond thermal management, with significant potential for future growth.

Sinolink released a research report stating that diamond, with its ultra-high thermal conductivity, will completely surpass the limits of traditional air cooling, copper liquid cooling plates, and even two-phase liquid cooling solutions, emerging as the ultimate solution. The pace of industrialization is accelerating, with applications starting to validate new approaches, and the supply side actively expanding production capacity. The potential growth space for diamond thermal management in the future is vast, and companies that are actively engaging in the diamond cooling sector are worth noting. Key points from Sinolink are as follows: What is diamond thermal management? Diamond is theorized to be the optimal thermal management material in terms of comprehensive performance: The room temperature thermal conductivity of single crystal diamond reaches 2000-2200 W/(mK), which is 5-6 times that of copper and more than 9 times that of aluminum, breaking through the thermal conductivity limits of traditional metallic materials. In addition to its extremely high thermal conductivity, diamond also features a low thermal expansion coefficient that is highly compatible with mainstream semiconductor materials, excellent electrical insulation properties, and a low dielectric constant. These characteristics make diamond the ultimate material for addressing the thermal management challenges of high heat flux density scenarios such as AI chips and GaN power devices. Diamond copper and single crystal/polycrystalline diamond adapt to different application needs: Diamond copper retains most of the thermal conductivity advantages while significantly reducing production costs and processing difficulties, making it the closest technology route to large-scale mass production. It can be directly used as a heat sink with vast application prospects in fields such as high-power chips, radar, lasers, and optical modules. Single crystal and polycrystalline diamonds serve as even more ideal thermal management materials, with polycrystalline diamond expected to land first, primarily produced through HFCVD or MPCVD techniques. Diamond can be integrated with semiconductor devices through independent heat sinks, bonding, and epitaxial growth: Diamond-based materials can first be used directly as heat sinks to replace existing thermal materials, processed into fin structures, and attached directly onto the surface of thermal shells of device packages through thermal interface materials (TIM), representing the simplest and most interchangeable solution. Single and polycrystalline diamonds can also be connected to semiconductor devices via bonding and epitaxy technologies; industry research on diamond/GaN device connections through bonding and epitaxial methods is already quite mature. For example, the cooling performance of diamond substrate GaN wafers has been significantly improved, and the future connection of diamonds with AI chips is expected to become a new industry trend. Diamond thermal management has the potential to become the ultimate solution for AI chip cooling, with accelerated industrial progress. The power consumption of AI computing is increasing exponentially, and traditional cooling solutions are approaching physical limits; diamond thermal management is expected to be the ultimate solution: Currently, as GPU chip power density increases and chips evolve towards 2.5D/3D stacking, we will gradually cross over the physical limits of traditional thermal materials, with localized hotspots reaching heat flux densities of 1000-2500 W/cm2, fully exceeding the limits of traditional air cooling, copper liquid cooling plates, and even two-phase liquid cooling solutions. Diamonds ultra-high thermal conductivity will serve as the definitive solution. Industrial progress is accelerating, with applications starting to verify new approaches, and the supply side actively expanding production capacity: On one hand, we see continuous acceleration on the application side; in February 2026, Akash Systems delivered the worlds first batch of NVIDIA H200 GPU servers equipped with diamond cooling technology, followed by the launch of diamond-cooled AI servers utilizing AMD Instinct MI350X GPUs. The CEO of Intel announced an investment in a synthetic diamond wafer company, underlining the potential of diamonds as a thermal management material in chip packaging. At the same time, domestic suppliers, such as Henan Huanghe Whirlwind and Beijing Worldia Diamond Tools, are actively expanding their production capacity in the diamond thermal management sector. For instance, Beijing Worldia Diamond Tools has already achieved the maximum size of 320mm x 320mm, compatible with mainstream wafer diameters of 50mm-300mm for diamond heat sinks, and has commenced delivery to customers for validation. Risk Warning Risks include slower-than-expected progress in large-scale commercialization and lower-than-expected downstream demand.