Northeast: The Revolution of Diamond Heat Dissipation Materials - Domestic Manufacturers Accelerate Breakthroughs

Northeast has released a research report stating that diamond is referred to as the "ultimate semiconductor material" within the industry and has become a key material for addressing the thermal bottlenecks of high-end chips. The industrialization of diamond-copper composite materials is progressing the fastest, with thermal conductivity reaching 800W/mK and achieving large-scale applications. However, the industrialization process still faces three major core barriers to mass production: constraints of cost and yield, challenges in optimizing interface thermal resistance, and inadequate mass production and delivery capabilities. Domestic manufacturers are relying on their industrial foundations to accelerate breakthroughs, while the progress of domestic enterprises varies. The main points from Northeast are as follows: As chip power density sharply increases, diamonds, with their excellent thermal physical properties, are becoming the next-generation core thermal materials. Driven by advanced packaging and 3D integration technologies, the total power consumption of high-end chips may approach 2000W, making traditional thermal materials like copper and aluminum inadequate to meet the cooling demands. Diamonds have a thermal conductivity of 20002200W/mK, five times that of copper, and possess excellent electrical insulation, a very low thermal expansion coefficient, and chemical stability. They are recognized within the industry as the "ultimate semiconductor material" and are key materials for solving the thermal bottlenecks of high-end chips. Three major technological pathways are developing in parallel, showing differentiated maturity in industrialization. Single-crystal diamonds have the highest thermal performance limit (thermal conductivity exceeding 2000W/mK), but mass production of large sizes is hindered by high costs, making large-scale use in industrial fields premature. Polycrystalline diamonds are expected to mature in 13 years, with thermal conductivity around 1500W/mK; the core challenges are achieving uniform growth in large sizes and precision processing yield. Diamond-copper composite materials have the fastest industrialization, with thermal conductivity reaching 800W/mK and achieving large-scale applications in April 2026, they will be used on a large scale for the first time at the Zhengzhou Supercomputing Center, boosting the thermal transfer capability of chip modules by 80%. The cultivated diamond sector is undergoing transformation, as AI computing power cooling opens up a second growth curve for the industry. Previously, the price of a one-carat finished diamond fell from nearly 30,000 yuan in 2021 to only 5,0006,000 yuan by the end of 2024, a cumulative decline of over 80%. Due to the U.S. restrictions on chip technology to China and the increasing demand for computing power, cultivated diamonds, initially focused on jewelry, are officially transforming into core functional materials for cooling applications. The industrialization of diamond cooling still faces three core barriers to mass production: constraints of cost and yield, challenges in optimizing interface thermal resistance, and inadequate mass production and delivery capabilities. Huawei's "Tao's Law" drives the iteration of 3D stacked chip cooling, accelerating the layout of international giants. Huawei has innovatively proposed "Tao's Law" ( Law), achieving chip performance upgrades through three-dimensional heterogeneous integration technology, pushing the application of 3D stacking technology, and presenting extreme requirements for cooling. NVIDIA announced that the next-generation Vera Rubin architecture GPU will adopt the "diamond-copper composite cooling module + direct liquid cooling system" solution to cope with the extreme thermal design power of 2300W; Intel is investing in Diamond Foundry to lay out synthetic diamond wafers; TSMC has completed verification of single-crystal diamond thermal materials, clarifying the demand for 12-inch products. International giants like Element Six and Orbray have mastered the production technology of 3-inch wafer-scale single-crystal diamonds, posing competitive pressure on domestic enterprises. Local manufacturers are accelerating breakthroughs based on their industrial foundations, while the progress of domestic enterprises varies. China's synthetic diamond production accounts for 95% of the global total, with Henan forming the world's largest diamond industrial cluster. Sf Diamond Co., Ltd.'s diamond heat sinks have passed customer testing and have entered the small-batch supply phase, with its subsidiary Tianxuan Semiconductor achieving revenue of 62.89 million yuan by 2025; Beijing Worldia Diamond Tools has successfully developed 12-inch diamond cooling wafers, with various products pushing forward customer validation; Sinomach Precision Industry Group is the first to land small-batch military orders; Henan Huanghe Whirlwind is seeking transformative breakthroughs through strategic layouts for heat sink plates. Risk Warning: The demand for data center construction may not meet expectations, and industry competition may intensify.