HK Stock Market Move | Luxshare Precision Industry (02475) rose more than 5% in the final trading session. The company confirms its layout in diamond copper and AI computing power to open up incremental space for diamond heat dissipation.

Luxshare Precision Industry (02475) rose more than 5% at the close, rising 5.42% as of the time of publication, to HK$62.25, with a turnover of HK$260 million. On the news front, on July 23, Luxshare responded to questions on the investor interaction platform, with the Company Secretary confirming that "diamond copper, as a self-developed project in the leading industry, has better thermal conductivity than ordinary copper, and a thermal expansion coefficient consistent with silicon, significantly reducing thermal resistance", and mentioning that "the research and development team's simulation capability is industry-leading, with the measured and simulated differences controlled within 1 degree". This is the first official confirmation from Luxshare Precision Industry about the layout of diamond copper. Soochow pointed out that AI computing power opens up space for diamond heat dissipation increment: AI chip power consumption and local heat flux density have significantly increased, traditional copper-aluminum heat dissipation has bottlenecks, diamond thermal conductivity is 5 times that of copper and 8 times that of aluminum, with a thermal expansion coefficient close to silicon, suitable for high-end chip heat dissipation. Diamond heat dissipation is layered from the outside to the inside along the cold plate, cover plate, chip back, and substrate, and in the short term, diamond copper/aluminum composite materials may be the first to mass produce, while in the medium to long term, CVD heat sinks will penetrate into high-end computing power.