Jinming Airlines, Kojie Technology, and 7 other companies have already received inquiries for their IPO on the Growth Enterprise Market.

The official website of the Shenzhen Stock Exchange shows that Jinming Airlines, Kejie Technology, Jinyi New Materials, Huapu Micro, Rukun New Materials, Dianduo Technology, and Herun Electronics, a total of 7 companies, have applied for a change in the status of their listing review on the Shenzhen Stock Exchange Growth Enterprise Market to "under inquiry." Jinming Airlines is sponsored by Guosen and plans to raise 9.7604 billion yuan. The prospectus shows that Jinming Airlines' main business is precision metal parts processing and manufacturing in the civil aviation aircraft manufacturing industry, with main products including various precision metal parts products such as interior parts, body structure parts, propulsion system parts, airborne equipment parts, eVTOL parts, medical device parts, and other precision metal parts. Kejie Technology is sponsored by China Securities Co., Ltd. and plans to raise 6 billion yuan. The prospectus shows that Kejie Technology is a domestic independent brand enterprise focusing on high-end CNC machine tool R&D, production, and sales in the field of precision machining. The company's main products include high-speed CNC engraving and milling machines, vertical machining centers, five-axis CNC machine tools, and it serves a wide range of manufacturing areas such as precision molds, consumer electronics, new energy vehicles, semiconductors, new displays, Siasun Robot&Automation. Especially in the precision processing of hard and brittle materials and metal structural parts, the company's CNC machines have surpassed international mainstream imported machines, effectively replacing imported brands. Jinyi New Materials is sponsored by Guosen and plans to raise 22.1905 billion yuan. The prospectus shows that Jinyi New Materials focuses on innovative technology research and industrial application of advanced inorganic functional powder materials. It has become a leading enterprise in the inorganic functional powder materials industry in the field of electronic information. The company's core products are high-performance spherical silicon powder materials, which have a significant impact on the key performance of downstream applications. Huapu Micro is sponsored by Guotai Haitong and plans to raise 22 billion yuan. The prospectus shows that Huapu Micro is mainly engaged in the research, production, and sales of wireless communication RF chips, modules, and high-precision sensor chips with Sub-1GHz technology as the core. It is one of the few domestic chip design enterprises with full self-research capabilities for Sub-1GHz wireless communication RF chips. The company focuses on the research and breakthrough of Internet of Things wireless communication transmission and collection technology. After years of technical accumulation, it has developed into an Internet of Things system-level service provider integrating RF chip design, firmware and protocol design, application development, and testing. Rukun New Materials is sponsored by CITIC SEC and plans to raise 12 billion yuan. The prospectus shows that Rukun New Materials has been focusing on the research, production, and sales of fine chemicals since its establishment. With its leading technological advantage, especially in chemical synthesis experience and rapid industrialization capabilities, the company has formed its core main business with new energy battery new lithium salts and additives, actively expanding to other high-end electronic and chemical product fields around the goal of "autonomous innovation of new materials," striving to become a leading domestic and internationally renowned professional provider of new materials solutions. Dianduo Technology is sponsored by Industrial and plans to raise 9.871 billion yuan. The prospectus shows that Dianduo Technology is a national-level specialized and sophisticated "Little Giant" enterprise focusing on the research, design, manufacturing, and installation services of semiconductor process exhaust systems. Its main products include process exhaust ducts, air valves, fittings, etc. The company deeply serves mainstream wafer foundries and IDM enterprises in the industry and has entered the supplier system of manufacturers such as Semiconductor Manufacturing International Corporation, Huahong Group, Changxin Technology, Yangtze Memory, Nexchip Semiconductor Corporation, China Resources Microelectronics, Hangzhou Silan Microelectronics, Hynix, Micron, Texas Instruments, Infineon, Intel, etc., and continues to participate in the construction of factories of the aforementioned manufacturers. Herun Electronics is sponsored by China Securities Co., Ltd. and plans to raise 12 billion yuan. The prospectus shows that Herun Electronics is an integrated circuit design enterprise specializing in satellite navigation positioning, analog signal chain, and power chain chip fields with full-stack technology capabilities. With technical capabilities in mainstream and characteristic processes such as CMOS, BCD, GaAs, SiGe, and large-scale production experience, the company has built a diversified product matrix centered on GNSS chips and modules, and the coordinated development of analog signal chains and power chain chip products.