CSRC approves Hongfucheng's IPO registration on the Shenzhen Stock Exchange

On July 10th, the China Securities Regulatory Commission issued the "Approval for the initial public offering of shares of Shenzhen Hongfucheng New Materials Co., Ltd." It is reported that Hongfucheng is planning to list on the Shenzhen Stock Exchange, with Huayuan Securities as the sponsoring institution, aiming to raise 1.22039 billion yuan. The prospectus shows that Hongfucheng is a national key "Little Giant" enterprise specializing in the research and industrialization of advanced electronic functional materials and devices such as thermal management, electromagnetic shielding, and absorbing materials. Its products mainly include thermal interface materials, electromagnetic shielding, and absorption materials. The company's independently developed graphene thermal pads and metal carbon-based composite materials have entered the supply chain of leading AI chip companies worldwide and are supplied in bulk.