New stock news | Nexchip Semiconductor Corporation (02249) concludes its IPO with a subscription amount of HKD 16.45 billion, oversubscribed by 234.65 times.

Nexchip Semiconductor Corporation (02249), a wafer foundry company, conducted its IPO from June 30, 2026 to July 7, 2026, and the latest round of IPO has ended. According to market sources, Nexchip Semiconductor Corporation has received a loan of HKD 164.534 billion from brokerages, based on a public offering amount of HKD 698 million, oversubscribed by 234.65 times. Nexchip Semiconductor Corporation plans to globally offer 216 million H shares, with approximately 10% for public offering in Hong Kong, approximately 90% for international offering, and an additional 15% for over-allotment option. The offering price per share ranges from HKD 30 to 32.3, with 100 shares per board lot and an entry fee of HKD 3,262.57. The company expects the H shares to be listed for trading on July 10 (Friday), with CICC as the exclusive sponsor. For this IPO, Nexchip Semiconductor Corporation introduced 20 cornerstone investors, including Asia-Info, CAS-HK, Shineon, Chery Auto HK, GTEC, Taikang Life, GF Fund, GYC, Shanghai Gaoyi, and CICC Financial Trading Limited (as related to GYC), Perseverance Asset Management, GF (HK), NGS Super, HHLR Advisors, Ltd., WT Asset Management, Ivy, Verition, Bo Yin, Da Cheng International, ICBC Wealth Management, China Post Wealth, and Franklin Templeton, with a total subscription amount of USD 430 million. Nexchip Semiconductor Corporation is a leading 12-inch wafer foundry company in the global semiconductor value chain. As a specialized wafer foundry service provider, the company mass produces high-quality processed wafers based on the integrated circuit design blueprint of fabless, light fab, and vertical IDM companies. The company's foundry services cover technical nodes from 150nm to 40nm, with a successful development of the 28nm logic chip platform as of the latest feasible date. The company's process capabilities focus on key categories of specific application integrated circuits, including Display Driver IC (DDIC) for display control, Complementary Metal-Oxide-Semiconductor Image Sensor (CIS) for image sensing, and Power Management IC (PMIC) for power regulation and optimization. The Logic IC (supporting data processing) and Microcontroller Unit (MCU, providing embedded control) have also grown rapidly during the performance period. With this product portfolio, the company can support various applications such as consumer electronics, automotive electronics, industrial control, Artificial Intelligence (AI), Internet of Things (IoT), and memory. According to Frost & Sullivan data, from 2020 to 2025, Nexchip Semiconductor Corporation had the fastest capacity and revenue growth rate among the top ten wafer foundry companies globally. By revenue in 2025, the company was the ninth largest globally and the third largest in mainland China. Financially, in 2023, 2024, and 2025, the company achieved revenues of approximately RMB 7.183 billion, RMB 9.120 billion, and RMB 10.388 billion respectively; and recorded profits of approximately RMB 1.19 billion, RMB 4.82 billion, and RMB 4.66 billion respectively. Nexchip Semiconductor Corporation plans to use approximately 53.6% of the net proceeds from the global offering for research and development and optimization of the new 22nm technology platform; approximately 23.1% for AI-based intelligent research and production; approximately 13.3% for establishing a research and sales center in Hong Kong, China; and approximately 10.0% for operating funds and general corporate purposes.