New stock news | Hubei Dinglong (300054.SZ) submits listing application to Hong Kong Stock Exchange.

According to the disclosure by the Hong Kong Stock Exchange on July 6th, Hubei Dinglong Holding Co., Ltd. (referred to as Hubei Dinglong) has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with CMSC International and CITIC SEC as joint sponsors. The prospectus shows that Hubei Dinglong is a leader in material application innovation in key industries in China. The company provides upstream integrated materials and solutions for the semiconductor industry, including Chemical Mechanical Polishing (CMP) solutions, semiconductor display materials, lithography materials, and advanced packaging materials. According to data from Frost & Sullivan, based on revenue forecast for 2025, the company is the largest domestic provider of Chemical Mechanical Polishing pads (CMP pads) in China with a market share of 38.5%, the third largest CMP materials provider in China with a market share of 16.8%, and the largest provider of OLED coating functional materials in China with a market share of 38.5%.