Crown Ceremony Technology, Clouded Leap Intelligence, and 7 other companies' applications for the ChiNext board IPO have been changed to "accepted".

On June 30th, Crown Gift Technology, Cloud Leopard Intelligence, Duogen Nexcore, Chenxin Technology, Fatumdi, Huapu Micro, and Great Wall Fine Engineering and 7 other companies' status of their Entrepreneurship Board IPO application changed to "accepted." Among them, Crown Gift Technology is one of the leading domestic providers of overall solutions for liquid chemicals, adhering to the business philosophy of "honesty, trustworthiness, simplicity, and practicality" since its establishment. The company focuses on the full-process management needs of liquid chemicals in the semiconductor industry chain, providing high-purity process medium systems and high-end wet process equipment for R&D, design, production, and sales. Cloud Leopard Intelligence is a leading domestic DPU chip design company, focusing on DPU and related product research, design, and sales. The company has achieved breakthroughs in technology and commercialization in the field of 400Gbps high-performance full-function DPU chips, providing one-stop solutions including elastic networking and storage, virtualization, security, and low-latency RDMA. Dugen Nexcore focuses on the research, production, and sales of high-power, high-speed, high-efficiency, and high-reliability optical chips, optoelectronic devices and modules, and light source systems. With a strong technical accumulation in the field of optical chips, the company has built a clear and balanced product system centered around high-power laser chips, high-power modules and systems; single-mode chips and optoelectronic modules, VCSEL chips and modules as strategic core businesses, focusing on the full optical network field, intelligent sensing field with broad market prospects; and optical communication chips and modules as forward-looking layout businesses, providing solid support for the company's sustained profitability and long-term competitiveness through coordinated development. Chenxin Technology is the only platform under China Infosys specializing in wireless communication chip design and related businesses, offering wireless communication chips and solutions for more than ten communication standards including 2G/3G/4G/5G, NTN, broadband self-networking, C-V2X, and technology evolution related to 6G and space-air-sea integrated communication. Fatumdi is a leading semiconductor packaging and testing hardware solutions provider, specializing in the research, production, and sales of high-performance test sockets, test interface components, covering the full life cycle from chip design to mass production delivery in the semiconductor field, providing packaging and testing hardware solutions for clients in the semiconductor industry chain. Huapu Micro has been focusing on wireless RF chips and modules and high-precision sensor chip research, production, and sales core of Sub-1GHz wireless communication technology since its establishment. With years of technological accumulation, the company has become a provider of IoT system-level services integrating RF chip design, firmware and protocol design, application development, and testing, one of the few chip design companies in China with self-development capabilities for Sub-1GHz wireless communication RF chips. Great Wall Fine Engineering is a leading domestic enterprise in ultra-precision bearings, specializing in providing high-precision, high-speed precision machine tool bearings and high-quality special-purpose bearings for various application fields for domestic and international clients. Application scenarios cover a wide range of fields including machine tools, motors, Siasun Robot & Automation, elevators, textile machinery, semiconductor equipment, automobiles, agricultural machinery, aerospace equipment, among many others.