Weijia Technology has applied for an IPO in the Science and Technology Innovation Board, specializing in the research and development, production, and sales of key equipment in the electronic packaging field.

date
18:52 29/06/2026
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GMT Eight
On June 29th, Suzhou Weijia Technology Co., Ltd.'s IPO on the SSE STAR Market has been accepted.
On June 29, Suzhou WeiJia Technology Co., Ltd. (referred to as WeiJia Technology) has had its IPO on the Shanghai Stock Exchange's Science and Technology Innovation Board accepted. Guotou Securities is its sponsor institution, with plans to raise 2.662 billion yuan. The prospectus shows that WeiJia Technology is dedicated to the research, development, manufacturing, and sales of key equipment in the field of electronic packaging. Their products include PCB specialized equipment, integrated circuit packaging and testing equipment, and have gradually extended their product layout from board-level packaging (second-level packaging) and component-level packaging (first-level packaging) to chip-level packaging (zero-level packaging). The company's products are widely used in the core processes of high-density printed circuit boards, integrated circuits, and other electronic components, with end applications covering artificial intelligence, AI computing power, data centers, and strategic emerging industries such as 5G/6G communication. In the field of advanced PCB process equipment, the company has become one of the very few global suppliers with integrated drilling, milling, and testing solutions. In the AI PCB field, the company has entered the supply chain system of major domestic AI PCB manufacturers such as Victory Giant Technology, Suzhou Dongshan Precision Manufacturing, Wus Printed Circuit, and Shennan Circuits, and has also successfully entered TTM Group, the largest AI PCB manufacturer in Europe and America, as the sole domestic supplier of TTM Group's key core equipment, CCD visual back drilling equipment, and CCD visual forming equipment. Furthermore, based on platform core technology, the company has extended its business to the integrated circuit packaging and testing field and has successively developed products such as semiconductor cutting and sorting equipment and wafer-level chip sorting equipment. During the reporting period, the company's procurement amount from the top five suppliers accounted for 34.82%, 38.39%, and 42.55% of the total raw material procurement amount, respectively, showing an increase in supplier concentration. In terms of market position, according to the PCB industry "special equipment and instruments" sales rankings released by the China Electronic Circuit Industry Association, in 2025, the company ranked as the second-largest drilling equipment supplier in China; especially in the field of advanced PCB process equipment, the company has taken a leading position in the AI PCB specialized equipment supply chain with its leading technology and product layout. Financially, in 2023, 2024, and 2025, the company's operating income was approximately 424 million yuan, 822 million yuan, and 1.028 billion yuan respectively; during the same period, the net profit was approximately -9.0645 million yuan, 37.7783 million yuan, and 108 million yuan respectively.