Guangdong Xin Semiconductor has received approval for its IPO on the Growth Enterprise Market, becoming the only mainland Chinese company with the ability to mass produce 12-inch silicon wafers.

On June 15th, Guangdong Xin Semiconductor Technology Co., Ltd. (referred to as Guangdong Xin Semiconductor) passed the listing committee meeting of the Shenzhen Stock Exchange ChiNext board. The sponsor of the IPO is GF SEC, planning to raise 7.5 billion yuan. According to the prospectus, the company is an integrated circuit manufacturing enterprise dedicated to providing 12-inch wafer foundry services and specialty process solutions for chip design companies at home and abroad. The company's core business model is specialty process wafer foundry, serving chip design companies and end customers, with major clients including top semiconductor design companies at home and abroad. The company has the capability of process research and development and manufacturing of integrated circuits, power devices, with products covering consumer electronics, industrial control, automotive electronics, and artificial intelligence. The company currently has two 12-inch wafer fabs, namely the first fab (Phase 1 and Phase 2 of Guangdong Xin) and the second fab (Phase 3 of Guangdong Xin), with a planned total capacity of 80,000 wafers per month. As of the end of 2025, the company has achieved a production capacity of 63,300 wafers per month. Currently, the company has initiated the construction of a 12-inch mixed-signal hybrid specialty process production line with a planned capacity of 40,000 wafers per month, known as the third fab (Phase 4 of Guangdong Xin). Upon completion of Phase 4 of Guangdong Xin, the company's total capacity will reach 120,000 wafers per month. In the field of integrated circuits, after years of technical accumulation, the company has developed MS (Mixed Signal), HV (High Voltage Display Driver), CIS (CMOS Image Sensor), eNVM (Embedded Non-Volatile Memory), BCD (Bipolar-CMOS-DMOS), and SiPho (Silicon Photonics) process technology platforms. In the field of power devices, the company has MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and IGBT (Insulated Gate Bipolar Transistor) process technology platforms. The company's diverse product portfolio and technological advantages enable it to meet the diverse needs of customers, adjust manufacturing processes to achieve customer's product performance and design goals. Additionally, the company actively advances into forward-looking areas, creating industry platforms such as silicon photon and optoelectronic fusion chips, microcontrollers, and integrated storage and computing chips, further expanding the downstream applications of cutting-edge technology. The company is the first 12-inch wafer manufacturing enterprise in Guangdong Province to be domestically cultivated and have entered into mass production, focusing on analog chip manufacturing, with a planned capacity of 120,000 wafers per month, providing important production support for the national integrated circuit industry strategic layout. According to SEMI's forecast, by 2025, Guangdong Xin Semiconductor's 12-inch wafer production capacity scale will be among the top in mainland China. The company has formed a diversified specialty process technology platform and established core competitive advantages in segmented product areas, with corresponding product shipment volumes ranking among the top in the industry. The company has become one of the world's leading capacitive fingerprint recognition chip wafer foundries in terms of shipment volume and one of the few domestic wafer foundries capable of large-scale production of silicon-based CMOS ultrasonic fingerprint recognition chips. The company's mobile power management chips are supplied to two of the top three independent mobile chip companies globally. With forward-looking layout in cutting-edge technology fields, according to Frost & Sullivan data, as of the end of April 2026, the company is the only enterprise in mainland China with large-scale production capacity for 12-inch silicon photon wafers. Financially, for the years 2023, 2024, and 2025, the company achieved operating revenues of approximately 1.044 billion yuan, 1.681 billion yuan, and 2.582 billion yuan respectively; during the same period, the company's net profits were approximately -1.917 billion yuan, -2.327 billion yuan, and -2.490 billion yuan respectively.