New Stock News | HGX Technology is currently going through a hearing at the Hong Kong Stock Exchange and is ranked among the top global optical module suppliers.

According to the disclosure of the Hong Kong Stock Exchange on June 11th, Beijing HiSilicon Optoelectronics Technology Co., Ltd. (referred to as HiSilicon Optoelectronics) is undergoing a listing hearing on the main board of the Hong Kong Stock Exchange, with Huatai International as its exclusive sponsor. The prospectus shows that HiSilicon Optoelectronics is a provider of optoelectronic interconnect products, offering optical modules, active optical cables (AOC) (which integrate optical modules and optical fiber cables into a single component to achieve high-speed interconnect), and other products. The company's optoelectronic interconnect products are widely used in AI data centers to support high-speed, high-density, and high-energy-efficient data transmission. The company differentiates itself in the market with its end-to-end technological capabilities spanning from chip design to optical module manufacturing, and focuses on silicon photonics technology. The company's portfolio of optical module products covers transmission rates of 100G, 200G, 400G, and 800G, compatible with various industry standard form factors. All single-mode optical modules with specifications of 400G and above use silicon photonics technology. The company's AOC and other product lines meet diverse customer needs, generating synergies in the product portfolio and creating cross-selling opportunities. According to Frost & Sullivan data, by revenue, the company ranks 17th among global optical module suppliers in 2025, with a market share of 0.8% in 2025 (by revenue calculation). Using the same source, based on AI optical module revenue in 2025, the company ranks eighth among Chinese optical module suppliers globally, with a market share of 1.6%. HiSilicon Optoelectronics designs, manufactures, and sells optoelectronic interconnect products, including (i) optical modules; (ii) AOC; and (iii) others. The company's silicon photonics optical modules are developed based on silicon photonics technology, aimed at applying silicon photonics chips to single-mode optical modules. As of June 8, 2026, the company's main silicon photonics optical modules have transmission rates of 400G and above. HiSilicon Optoelectronics has four commercially available silicon photonics optical modules and one under development. Other optical modules mainly include 100G, 200G, 400G, and 800G multimode optical modules. AOC is used for short-distance interconnect needs within a cabinet or between adjacent devices, serving as a complement to optical modules, which are typically used for longer-distance data transmission between servers and switches. As of June 8, 2026, the company's silicon photonics AOC is under development. Leveraging proprietary technology, the company is developing silicon photonics AOC, such as 400G silicon photonics AOC, 800G silicon photonics AOC, and PCIe 6.0 AOC, to meet the growing demand for high bandwidth, lower power consumption, and stronger integration in the market. The company's other AOC products are commercialized and in mass production. Other AOC products are widely used in data centers and other high-speed transmission scenarios. AEC is a high-speed electrical interconnect product integrating chips with active equalization and amplification functions at both ends of copper cables to improve signal integrity and extend transmission distances. HiSilicon Optoelectronics began commercializing our AEC products in December 2025. In terms of finances, in 2023, 2024, and 2025, HiSilicon Optoelectronics had revenues of approximately 175 million, 862 million, and 1.221 billion RMB respectively. Over the same period, net losses were approximately 109 million, 17.895 million, and 100 million RMB respectively.