PATEO (02889) plans to join hands with Ping An Capital to acquire a photoelectric chip company and extend its industry chain to upstream chip manufacturing.

date
22:19 02/06/2026
avatar
GMT Eight
BoTai Car Alliance (02889) announced that on June 2, 2026 (after trading hours), the company (Buyer 1), Ping An Capital Limited Liability Company (Ping An Capital) or its managed funds (Buyer 2, collectively referred to as the "Buyers"), the controlling shareholder and shareholders of the target company (Sellers), and the target company have entered into a memorandum of understanding regarding the Buyers' proposed acquisition of the target company's shares by way of cash consideration, in order to acquire a controlling stake and controlling interest in the target company.
PATEO (02889) announced that on June 2, 2026 (after trading hours), the company (Buyer 1), Ping An Capital Limited Liability Company (Ping An Capital) or its managed fund (Buyer 2, collectively referred to as "Buyer"), the controlling shareholder and shareholders of the target company (Seller), and the target company have entered into a memorandum of understanding regarding the Buyer's proposed acquisition of the target company's shares held by the Seller for cash consideration to acquire controlling and controlling rights over the target company. It is reported that the target company is a professional integrated circuit design enterprise specializing in high-performance communication chip development, adopting a Fabless business model, mainly engaged in the research, design, and sales of high-speed optoelectronic chips, high-performance analog chips, and modules. Its optoelectronic chip products are one of the core chips in optical modules in current AI data centers and are in a scarce industry direction in response to domestic demand. The proposed transaction aims to drive the company's strategic extension into the upstream chip field. If the transaction is successful, the company will incorporate the target company's core capabilities in optoelectronic chips, optical modules, and top customer resources into the system, further strengthening the integrated strategy of "soft and hard cores in the cloud," promoting the company to form a composite industrial layout of "smart car solutions + high-performance communication chips."