New Share Listing News | Union Semiconductor (688403.SH) Submits Application to Hong Kong Stock Exchange
According to the disclosure on May 29th by the Hong Kong Stock Exchange, Hefei Xinhui Cheng Microelectronics Co., Ltd. has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with CICC as the exclusive sponsor.
According to the disclosure of the Hong Kong Stock Exchange on May 29th, Hefei Union Semiconductor Co., Ltd. (referred to as Union Semiconductor (688403.SH)) has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with CICC as the sole sponsor. According to data from Frost & Sullivan, Union Semiconductor ranked second in revenue in the advanced packaging and testing market for DDICs in mainland China in 2025; and ranked second in the mainland China packaging and testing market based on the shipment volume of 12-inch wafer bump in 2025. With a shipment volume of 511.3 thousand wafer pieces, the company has become the fourth largest provider of advanced packaging and testing services for DDICs worldwide.
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