Sinolink: Lightweight, Flexible, High barriers bring new opportunities, space photovoltaics suggest focusing on four main lines layout.

Sinolink released a research report stating that space photovoltaics has entered a period of rapid growth in communication infrastructure and computing power, with the rapid increase in the penetration rate of flexible solar panels. Space-grade auxiliary materials have become key bottlenecks and high-profit sectors in the industry chain. It is recommended to focus on four main areas: 1) conductive paste adapted to low temperature and space environment; 2) flexible packaging core UTG/CPI cover plates and substrate materials; 3) potential space-grade encapsulation adhesives; 4) high-reliability interconnection materials. Sinolink's main points are as follows: Space Photovoltaics Currently, space photovoltaics is gradually iterating from the high-cost gallium arsenide route to the cost-effective crystalline silicon and crystalline silicon-perovskite tandem direction. With the large-scale deployment of low-orbit satellite constellations and the continuous increase in single satellite power, satellite solar panels are moving towards lightweight, flexible, and high packaging density, driving the reconstruction of the packaging and ancillary material system. In the space environment, the constraints of atomic oxygen erosion, high-energy particle radiation, extreme temperature cycles, and vacuum are significantly higher for material systems in terms of formulation, structure, and reliability compared to ground-based photovoltaics. On the demand side, global communication satellites are entering a high-speed launch phase, and computing satellites are entering the planning and deployment phase, driving the installation demand for space photovoltaics from hundreds of MW to hundreds of GW levels. The significant increase in solar panel area and single satellite power will directly drive the expansion of demand for conductive paste, packaging materials (cover plates/substrates, adhesives), busbar interconnections, and other ancillary materials. Due to the high requirements of the aerospace industry chain for material reliability and the significant impact of component weight on launch costs, the value of space ancillary materials is expected to be significantly higher than similar products on the ground, becoming a new high-value-added track in the photovoltaic industry chain. Conductive Paste: Space environment raises the performance threshold for low-temperature pastes Space photovoltaics mainly use low-temperature battery routes such as HJT and perovskite, and metallization needs to be completed at 200C, posing special requirements on the paste system. Since low-orbit atomic oxygen can erode silver electrodes and high-energy radiation in space can cause material performance degradation, there is also a need to prevent the risk of corrosion from "red plague." Therefore, pure silver paste remains the mainstream solution at this stage. For manufacturers, the final application of space paste needs to undergo strict aerospace tests such as thermal cycling, radiation resistance, and low outgassing, with a long verification cycle and high barriers. Enterprises with accumulation of low-temperature paste technology and aerospace adaptive capabilities are expected to quickly enter the supply chain. Front cover plates and substrates: Flexible solar panels drive demand for CPI and UTG films Traditional rigid glass cover plates are heavy and cannot be folded, making it difficult to meet the high packaging density requirements of large-area solar panels. Colorless and transparent polyimide (CPI) and ultra-thin flexible glass (UTG) have become the next generation of packaging materials. CPI film has advantages such as lightweight and flexibility and can improve its radiation resistance and atomic oxygen resistance through molecular modification, making it likely to be introduced into overseas markets first. UTG glass has advantages such as natural resistance to atomic oxygen, high transparency, and high surface hardness, suitable for flexible packaging. Adhesives: Space-grade silicone adhesive is the current mainstream solution, with adhesive companies actively researching and developing The space environment has strict requirements for adhesives, such as high and low-temperature resistance, UV resistance, low outgassing, and high bonding stability. Space-grade organic silicon adhesives have become the current mainstream choice but have issues such as high cost and complex packaging processes. The industry is actively promoting new solutions such as modified epoxy resins, UV-curable adhesives, modified POE, and butyl adhesives, which balance reliability and low cost, and are compatible with various technology routes such as crystalline silicon, perovskite, and gallium arsenide. Enterprises with advanced adhesive technology capabilities on the ground and verified in aerospace environments have the potential to achieve domestic substitution in the packaging process. Interconnection wafers: Can-dissolve materials and conductive adhesives may become the trend for space interconnection wafers Space solar cell arrays are composed of multiple individual cells interconnected by conductive materials. Currently, space solar cell interconnection wafers commonly use pure silver materials. With a trend towards long service life, low cost, and flexibility, can-dissolve alloys have excellent resistance to atomic oxygen erosion and can reduce costs, leading companies to actively pursue research and development; low-temperature welding technologies such as conductive adhesives can reduce the risk of thin silicon wafer fragmenta