SHANGHAI FUDAN (01385) plans to collaborate with Fudan University to jointly build an integrated circuit technology center.

SHANGHAI FUDAN (01385) announced that on May 11, 2026 (after the end of the trading session), the company signed a cooperation agreement with Fudan University and GUOSHENGTOUZI to jointly establish the Fudan University Integrated Circuit Engineering Technology Integration Innovation Center. The company agreed to jointly build the Integrated Circuit Technology Center with Fudan University, collaborating on research and technological breakthroughs in the field of integrated circuits. The collaborative research and development projects are driven by the major demands of national economic development, closely tracking the international advanced technologies in fields such as FPGA, intelligent computing, and new storage, breaking through the high-end FPGA EDA engineering technology bottleneck, promoting the innovation of domestic high-end FPGA architecture design and hardware platform technology, creating a combination of domestic high-end FPGA software technology platform and hardware technology platform, fundamentally solving the bottleneck of high-end FPGA dependence on imports, enhancing China's independent innovation capabilities and international competitiveness in areas such as domestic high-end FPGA chips, intelligent computing, and high-reliability storage, effectively meeting the country's major strategic needs. The company will pay a total of RMB 20 million as a startup fee for the Integrated Circuit Technology Center. The startup fee includes but is not limited to one-time expenses for talent introduction, research platform construction expenses (equipment, software, etc.), venue rental expenses, venue renovation expenses, various consumables expenses, as well as electricity, fuel, and water expenses. During the cooperation period, the company plans to provide cooperation funds of no more than RMB 1 billion to the center. Within sixty months from the effective date of this agreement, the Integrated Circuit Technology Center will focus on the company's business strategy and product planning, conducting research and development on IP technology platforms including but not limited to super high-speed transceivers, ultra-high-bandwidth RF direct-sampling analog-to-digital converters, network acceleration, PCIe5, multi-rate Ethernet, etc., as well as conducting research on the next generation FPGA overall architecture design, artificial intelligence heterogeneous chip core technology and architecture innovation. The company is responsible for proposing forward-looking scientific and technological issues that need to be addressed, and the two parties will sign specific technology development agreements based on the topics proposed by the company, clarifying research and development goals, research and development funds, and research and development deliverables. Research and development expenses will be implemented according to the plan specified in the technology development agreement, including but not limited to salaries of full-time researchers, labor costs for students and/or experts, investment in personalized equipment, etc. Fudan University will apply for key research and development projects at the national or provincial level based on the specific collaborative research and development projects determined by both parties and strive to obtain government financial support for various planned project expenses related to collaborative research and development.