New Stock News | Xinde Semiconductor applies for listing on the Hong Kong Stock Exchange, focusing on semiconductor packaging and testing, covering advanced packaging technologies such as QFN and BGA.

According to the disclosure made by the Hong Kong Stock Exchange on May 8th, Jiangsu Xinde Semiconductor Technology Co., Ltd. (referred to as Xinde Semiconductor) has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International as the exclusive sponsor. Xinde Semiconductor had submitted its application on October 31, 2025. Company Profile The prospectus shows that Xinde Semiconductor is a semiconductor packaging and testing technology solution provider, mainly engaged in developing packaging designs, providing customized packaging products, and packaging product testing services. According to Frost & Sullivan data, in the "post-Moore era" where transistor density growth is approaching its size limit, relying on new semiconductor packaging architectures (such as miniaturization, thinning, high efficiency, heterogeneous integration, etc.) as a key link connecting chip design and application has become the key DRIVE to improving chip performance, efficiency, and functionality flexibility. The company is one of the enterprises in China with advanced packaging technology capabilities, able to drive breakthroughs in semiconductor innovation technology in the "post-Moore era", and support the development wave of the "AI+" era. Since its establishment in September 2020, Xinde Semiconductor has expanded into the field of advanced packaging, accumulated packaging technology experience, and has advanced packaging production capabilities, covering QFN, BGA, LGA, WLP, and 2.5D / 3D, among others. The company is one of the few advanced packaging product providers in China that has first-class expertise in all of these technologies. The company has established the "Chip and Advanced Packaging Technology Platform (CAPiC)" covering all technical branches in the field of advanced packaging, in order to advance its technological knowledge and continue to research and develop technology. Xinde Semiconductor's position in the packaging industry is due to the company's ongoing investments in technological innovation and progress. The company has registered and is applying for registration of independently developed intellectual property. As of April 30, 2026, the group owns 225 patents in China, including 39 invention patents and 186 utility model patents, covering key areas such as packaging structures, methods, equipment, and testing systems. The company also has three PCT patent applications. Financial Information Revenue In 2023, 2024, and 2025, the company's revenues were approximately RMB 509 million, RMB 827 million, and RMB 1.012 billion, respectively. Total Loss Amount In 2023, 2024, and 2025, the company had total comprehensive losses of approximately RMB 359 million, RMB 377 million, and RMB 483 million, respectively. Industry Overview The semiconductor market is large and has broad prospects. As the global economy develops and technological innovation advances, semiconductors, which are recognized as the core of the information technology and electronics industries, are becoming increasingly important. The rapid development of emerging technologies such as AI, 5G, IoT, and automotive electronics has sparked strong demand for high-efficiency and low-power consumption chips, thereby driving continuous growth in the semiconductor market. Semiconductor packaging involves a series of processes that encapsulate manufactured bare chips or wafers into protective shells, providing physical protection, electrical interconnections, and thermal management, so that semiconductors can be used as independent devices in various electronic devices. Semiconductor testing uses specialized equipment to evaluate electrical performance, functional integrity, reliability, and environmental adaptability, to screen out qualified products and eliminate defective ones. The global semiconductor market has tremendous potential and extensive room for development. The vibrant development of consumer electronics, automotive electronics, industrial control, and other fields has driven demand for semiconductors. In the next five years, as Moore's law slows down, advanced packaging and testing as the core path to improving chip efficiency will further benefit from the popularity of autonomous driving, data centers, high-performance computers, smart wearable devices, and the increasing maturity of frontier packaging and testing technologies, and will continue to maintain a strong growth momentum, with the market size expected to steadily expand. Compared to traditional packaging with relatively low added value and a saturated market, advanced packaging has high technological barriers and scarce supply characteristics. Its unit price and demand growth rate are significantly higher, making its market size growth rate expected to surpass the overall packaging and testing industry in the long run. Board of Directors Information The company's board of directors consists of nine members, including four executive directors, two non-executive directors, and three independent non-executive directors, responsible for and having general authority in the management and operation of the company. Directors serve a term of three years and may be re-elected after the term expires. Equity Structure As of April 30, 2026, (i) Mr. Zhang Guodong directly holds approximately 5.38% equity in the company; (ii) Mr. Pan Mingdong directly holds approximately 3.01% equity in the company; (iii) Mr. Liu Yi directly holds approximately 1.04% equity in the company; (iv) Nanjing Ningtai Xinqi Enterprise Consulting Management Partnership (Limited Partnership) directly holds approximately 9.49% equity in the company; and (v) Ningbo Meishan Free Trade Port Ningpu Xinqi Enterprise Management Partnership (Limited Partnership) directly holds approximately 6.02% equity in the company. Intermediary Team Exclusive Sponsor: Huatai Financial Holdings (Hong Kong) Limited Company Legal Advisor: Hong Kong Law: Tian Yuan Law Firm (Limited Liability Partnership); Chinese Law: Jiangsu Shiji Tongren Law Firm; International Sanctions and Export Control Law: Anrsundell International Law Firm Legal Advisor to the Exclusive Sponsor: Hong Kong Law: Jing Tian Gong Cheng Law Firm (Limited Liability Partnership); Chinese Law: Jintiancheng Law Firm Auditors and Reporting Accountants: Ernst & Young Industry Consultant: Frost & Sullivan (Beijing) Consulting Co., Ltd. Shanghai Branch Compliance Consultant: Huafu Jianye Corporate Financing Co., Ltd.