New Stock News | JCET Semiconductor Once Again Submits Application to Hong Kong Stock Exchange, Ranked Fourth Globally in Manufacturers Focusing on Intelligent Terminal SoC Chips

date
07:51 13/04/2026
avatar
GMT Eight
According to the disclosure by the Hong Kong Stock Exchange on April 12th, JCET Group (Shanghai) Co., Ltd. (referred to as JCET Group) has once again submitted its listing application to the main board of the Hong Kong Stock Exchange, with China International Capital Corporation and Haitong International acting as its joint sponsors.
According to the disclosure on the Hong Kong Stock Exchange on April 12th, Shanghai Jingchen Semiconductor (Jingchen Semiconductor) has once again submitted an application for listing on the main board of the Hong Kong Stock Exchange, with CICC and Haitong International as its joint sponsors. Company Introduction According to the prospectus, the company is a leading system-level semiconductor design manufacturer, providing outstanding intelligent terminal control and connectivity solutions for smart homes, smart offices, smart travel, entertainment education, industrial production scenes, including intelligent multimedia and display SoC master control chips, AIoT SoC master control chips, communication and connectivity chips, intelligent automotive SoC chips, etc., committed to empowering global intelligent terminals from the Internet of Things to the Internet of Everything. According to a Frost & Sullivan report, based on the related income projections for 2024, the company ranks fourth globally among vendors focusing on smart terminal SoC chips (with a global market share of 1.2%) and ranks first in mainland China and second globally in the field of smart terminal SoC chips for home applications (with a global market share of 17.7%). Since its establishment, the company has focused on system-level SoC chips with high system complexity and multidimensional overlapping technologies, with 30 years of deep experience in SoC chip design. The company has developed a highly self-developed technical matrix covering multiple functional modules including neural network processors NPU, video codecs, audio codecs, display controllers, memory systems, security systems, wide area/local area network interfaces, input/output subsystems, etc., to meet diverse requirements in intelligent terminal scenarios. The company is also dedicated to the research and development of communication and connectivity chips and has made significant progress in key areas such as baseband, radio frequency, and protocol stacks over more than 10 years of self-developed IP iteration. The company's self-developed wireless communication Wi-Fi chips and LTE chips are highly adaptable to the company's SoC chips, meeting the diverse requirements of AIoT scenarios. The company's SoC and chip products can be directly integrated into a range of consumer electronic products such as smart TVs, set-top boxes, and smart home devices. Typically, the company's end customers integrate the company's products in component form during the manufacturing process. For example, in the case of smart TV SoCs, TV manufacturers solder the company's SoCs as the main chip onto the motherboard to work in conjunction with hardware and software to provide basic functions such as display driver control, smart control, and network connectivity. The company's smart TV SoCs have become the main processing units for smart TVs produced by leading TV brands such as Xiaomi and Hisense, enabling advanced functionalities such as 4K video decoding and AI image optimization. The company has been deeply cultivating the broad field of smart home living on a global scale, targeting large markets, seizing growth opportunities, establishing a leading position, achieving great commercial success, and building high business barriers. As of December 31, 2025, the company's cumulative chip shipments have exceeded 1 billion units. According to data provided by Frost & Sullivan, in 2024, for every 3 smart set-top boxes globally, one is equipped with the company's smart set-top box chip, and for every 5 smart TVs, one is equipped with the company's smart TV chip. The company's business covers more than 270 leading global operators, leading TV brands (such as Hisense, TCL, and Skyworth), as well as numerous AIoT and automotive manufacturers, integrated into household screens in over 100 countries and regions worldwide. Financial Information Revenue In 2023, 2024, and 2025, the company's revenue was approximately RMB 5,371 million, RMB 5,926 million, and RMB 6,791 million, respectively. Profit In 2023, 2024, and 2025, the company's annual profits were approximately RMB 499 million, RMB 819 million, and RMB 870 million, respectively. Gross Margin In 2023, 2024, and 2025, the company's gross margins were 33.2%, 37.1%, and 37.8%, respectively. Industry Overview Intelligent devices refer to devices with operating systems, processing capabilities, and network connectivity functions that can run multiple applications and interact with users. Typical intelligent device products include smart TVs, smart set-top boxes, smart speakers, smart cars, smartphones, tablets, wearable devices, etc. Intelligent device SoCs are the key hardware foundation that determines the functional boundaries, performance, and energy efficiency of intelligent devices. They provide core computational power for intelligent devices, supporting the operation of complex operating systems and applications. Integrated AI computation capabilities enable devices to have edge AI processing capabilities, enabling experiences such as voice recognition, image processing, real-time translation, etc. SoCs directly determine the responsiveness, battery life, multitasking capabilities, and user experience of intelligent devices, serving as the key engine driving the continuous upgrade of intelligent devices. Advancements in AI algorithms, represented by large models, drive the rapid application of AI models on devices. The introduction of generative AI accelerates the migration of AI inference models to the edge, promoting the evolution of AI models towards lightweight, efficient, and customized solutions. With the rapid growth of intelligent devices equipped with AI computation capabilities, the demand for edge AI computing in low-power devices will also significantly increase. AISoCs, by integrating NPUs and optimizing algorithms and chip cooperation, can effectively unleash real-time inference and decision-making capabilities on the edge, serving as essential infrastructure for AI penetration in devices. Intelligent device AISoCs are SoCs optimized for AI workloads on intelligent devices, typically handling matrix operations, convolutional neural networks, and other AI tasks, providing efficient parallel processing capabilities. In addition to traditional intelligent device SoCs, intelligent device AISoCs integrate modules designed for AI computation, making them particularly suitable for computational-intensive tasks. AI accelerators (usually NPUs) are the core elements that distinguish intelligent device AISoCs from intelligent device SoCs. Board of Directors' Information The company's board of directors is composed of the following directors. Directors serve a term of three years and must be re-elected for consecutive terms at the end of their respective terms. Ownership Structure As of the last practicable date (April 7, 2026), Amlogic Semiconductor (Hong Kong) Limited is wholly owned by Amlogic Holdings Ltd. Amlogic Holdings Ltd. is 51.60% owned by Mr. John Zhong, 8.12% owned by Mrs. Yeeping Chen Zhong (spouse of Mr. John Zhong), and 11.27% owned by Cowin Group Limited (fully owned by Mr. Chen Haitao, father of Mrs. Yeeping Chen Zhong). Under Chinese laws and regulations, Mr. John Zhong, Mrs. Yeeping Chen Zhong, and Mr. Chen Haitao are considered to be acting in concert, and therefore are deemed to have interests in each other's shares. Therefore, under the Securities and Futures Ordinance, Amlogic Holdings Ltd., Mr. John Zhong, Mrs. Yeeping Chen Zhong, and Mr. Chen Haitao are considered to have interests in the shares held by Amlogic (Hong Kong) Limited. Advisory Team Joint Sponsors: China International Capital Corporation Hong Kong Securities Limited, HAITONG INT'L Capital Limited; Legal Advisors: NLD Law Firm, Jia Yuan Law Firm, Holman Fenwick Willan LLP; Joint Sponsors and Co-compiled Legal Advisors: Haiwen Law Firm sole responsibility partnership, Haiwen Law Firm Beijing branch; Auditors and Reporting Accountants: Deloitte Touche Tohmatsu Limited; Industry Consultant: Frost & Sullivan; Compliance Advisor: SOMERLEY CAP Limited; Property Valuer: Jones Lang LaSalle (JLL) Corporate Appraisal and Consulting Co., Ltd.