Nexchip Semiconductor Corporation (688249.SH) has resubmitted its application for an H-share initial public offering to the Hong Kong Stock Exchange and published the application materials.

Nexchip Semiconductor Corporation (688249.SH) announced that it has re-submitted an application to the Hong Kong Stock Exchange for the issuance of overseas listed foreign shares (H shares) and listing on the main board of the Hong Kong Stock Exchange on March 31, 2026. The company also published the application materials on the Hong Kong Stock Exchange website on the same day. The application materials were prepared and published in accordance with the requirements of the Hong Kong Securities and Futures Commission and the Hong Kong Stock Exchange. The information contained in the application materials is a draft version and may be updated and revised in a timely manner. Investors should not make any investment decisions based on the information contained in the materials.