Hong Kong Innovation and Technology Bureau: Innovation and Technology Support Scheme (Platform and Seed) will start accepting applications from May 18th.
On April 1st, the Hong Kong Innovation and Technology Bureau announced that applications for the 2026 Innovation and Technology Support Program (Platform and Seed) will be accepted from May 18th to July 17th.
On April 1, the Hong Kong Innovation and Technology Bureau announced that it will accept applications for the 2026 Innovation and Technology Support Program (Platform and Seed) from May 18 to July 17. The program aims to support applied research and development projects conducted by research centers or designated local public research institutions, and transfer research results to the local industry. "Platform" projects are industry-based and have commercialization potential; "Seed" projects are exploratory and forward-looking.
A spokesperson stated that, in order to fully cooperate with the National 15th Five-Year Plan, the Hong Kong Innovation and Technology Bureau welcomes applications that are closely related to the fields of technology such as quantum technology, artificial intelligence, and others that align with the requirements of the plan.
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