Huatai (06886): "25 Huatai S3" will be redeemed and delisted on March 23.
Huatai Securities (06886) announced the public issuance of short-term corporate bonds (third tranche) targeted at professional investors in 2025 and the redemption and delisting in 2026. The bond is designated as 25 Huatai S3, with a face interest rate of 1.77% per annum, and a redemption amount of RMB 1,000 per bond. The interest payment is RMB 16.197 per bond (tax included). The redemption date is March 23, 2026.
Huatai (06886) issued a public announcement for the issuance of short-term corporate bonds (third phase) for professional investors in 2025, with maturity and delisting in 2026. The bond is abbreviated as 25 Huatai S3, with a face interest rate (annual interest rate) of 1.77%. Each unit of the bond has a principal redemption value of RMB 1,000, with an interest distribution of RMB 16.197 (tax included). The maturity and interest payment date is March 23, 2026.
Related Articles

KINGLAND GROUP (01751) issues profit warning, expecting net loss attributable to shareholders for the year 2025 not to be less than HK$10 million.

Arthur Yu has been appointed as the Chief Financial Officer.

Shareholder of Zbit Semiconductor, Inc. (688416.SH) intends to reduce their total holdings by no more than 3%.
KINGLAND GROUP (01751) issues profit warning, expecting net loss attributable to shareholders for the year 2025 not to be less than HK$10 million.

Arthur Yu has been appointed as the Chief Financial Officer.

Shareholder of Zbit Semiconductor, Inc. (688416.SH) intends to reduce their total holdings by no more than 3%.

RECOMMEND

European Carmakers Embrace China: Under Technology And Cost Pressure, Stellantis And Mercedes Seek Partnerships With Chinese Automakers
17/03/2026

HKEX Listing Mechanism Reform Revisited: How To Balance New Favorites And Established Names
17/03/2026

International Oil Prices Plunge Boosts U.S. Stocks; Morgan Stanley Chief Says Market Correction Nearing End
17/03/2026


