Micron (MU.US) officially announces mass production of HBM4, partnering with NVIDIA Corporation (NVDA.US) to seize the opportunity with the Veo Rubin platform.

Against the background of the continuous surge in demand for AI computing power, NVIDIA Corporation's GTC 2026 conference once again became a benchmark for the global semiconductor industry, and storage giant Micron Technology, Inc. made a statement at this grand event, injecting new variables into the competition in the high-performance storage market. Micron not only officially confirmed at the venue that it would mass produce high-performance HBM4 memory for NVIDIA Corporation's next-generation Vera Rubin AI platform, but also showcased its indispensable ecological position in the computing power supply chain with its centralized landing of full-stack storage solutions. The 36GB 12-Hi HBM4 memory mass-produced by Micron this time not only achieved an astonishing bandwidth of over 2.8 TB/s, but also increased the energy efficiency ratio by more than 20% compared to the previous generation products, which is crucial for solving the "power consumption wall" issue in large-scale, large-model training. It is worth noting that Micron's management clearly stated at the event that the company's HBM production capacity for the entire year of 2026 has been basically sold out, and the vast majority of orders have signed legally binding long-term purchase agreements. This highly locked-in order situation indicates that the HBM market has completely transformed from traditional cyclical spot trading to a deep binding model based on customized technological collaboration. As the sole major HBM supplier in the United States, Micron's strategic premium is accelerating. To maintain a leading edge in technology, Micron has not stopped at the mass production of 12-layer stacked products. The company announced that it has begun delivering more disruptive 48GB 16-Hi HBM4 samples to core customers, with a single chip capacity 33% higher than the current mass-produced version, aiming to provide more powerful memory redundancy for the subsequent upgrade of the Vera Rubin platform. At the same time, Micron is actively advancing the research and development of the next generation HBM4E, which is expected to enter the sampling stage in the second half of 2026. In addition to continuous efforts in the memory field, Micron's system-level storage collaboration capabilities showcased at GTC are also noteworthy. The industry's first PCIe 6.0 data center SSD in mass production (Micron 9650) set a new industry record with a sequential read speed of 28 GB/s, complemented by the 192GB SOCAMM2 memory module designed specifically for the Vera CPU, Micron is building a complete storage loop covering GPU memory, system memory, and high-speed cache. This full-stack supply capability not only optimizes the overall operational efficiency of NVIDIA Corporation's NVL72 and other ultra-large scale systems, but also enhances the inference response speed of Agentic AI, giving Micron a broader voice in the high-performance computing market. In terms of industry competition, Micron's high-profile announcement of mass production holds significant strategic significance. Earlier in 2026, there were rumors in the market that Micron was behind SK Hynix and Samsung in the development progress of HBM4, and there were even reports that its market share would be divided by major competitors. However, Micron's strong response through actual mass production shipments has proved that it has returned to the industry's leading camp in advanced processes and packaging technologies. Analysts point out that with substantial revenue contribution from HBM4 in the 2026 fiscal year, Micron's gross margin and profitability are expected to be further improved. Currently, the competition among the world's three major storage giants in the HBM4 race has entered a white-hot stage, and Micron's pioneering breakthrough on the NVIDIA Corporation Vera Rubin platform has enabled it to seize the initiative in future market competition. "The next era of artificial intelligence will be defined by the entire ecosystem through deep integrated platforms developed through collaborative engineering innovation," said Sumit Sadana, Executive Vice President and Chief Business Officer of Micron Technology, Inc., "Our close collaboration with NVIDIA Corporation ensures that computing and memory are synergistically expanded from the outset." He further added, "With the mass production of HBM4 36GB 12H, the industry's first SOCAMM2, and Gen6 SSD, Micron is building the core infrastructure to unleash the full potential of next-generation artificial intelligence." As of the Tuesday closing, Micron Technology, Inc. stock price rose by 4.5%, continuing to rise by 2.21% in after-hours trading, and finally closed at $471.97.