New Stock News | Fourier Semiconductor successfully passed the hearing of the Hong Kong Stock Exchange, sprinting to become the first stock of "AI audio chips"

On March 15, the Hong Kong Stock Exchange disclosed that Shanghai Fourier Semiconductor Co., Ltd. has successfully passed the listing hearing on the main board of the Hong Kong Stock Exchange, officially entering the key stage of the Hong Kong IPO, aiming to become the "first AI audio chip stock". As a leading provider of AI audio chips and system solutions in China, Fourier Semiconductor is dedicated to creating a better human-machine interaction experience through its leading intelligent sensing technology. Founded in Shanghai in 2016, Fourier Semiconductor is a national-level high-tech enterprise. With a core of self-developed full-stack architecture and AI intelligent algorithms, the company uses integrated hardware and algorithms to achieve functions such as dynamic adjustment, real-time operational monitoring, environmental adaptation, and emulation. Its intelligent audio chip market ranks third globally and second in China, with a leading market share in the smart screen segment. In addition to intelligent audio chips, its haptic feedback chips have already achieved mass production and are among the top tier domestically. The company has built a rich product matrix, achieving comprehensive coverage of Android smartphone brands and connecting with top customers in the industry ecosystem. Fourier Semiconductor integrated into Samsung's ODM supply chain as early as 2018 and later into Samsung's self-developed system in 2022, making it one of the few successful Chinese chip companies to expand internationally. In the consumer electronics sector, its products are widely used by well-known brands such as Samsung, Xiaomi, Vivo, Honor, Transsion, Rockchip, Smartisan, and Rokid. In the smart home sector, they work with leading companies like Skyworth, Hisense, and TCL. In the automotive sector, they are deeply involved in the supply chains of BYD, Changan, and Chery. The company also covers personal lifestyle scenarios, focusing on consumer electronics, smart homes, automotive, and emerging AI applications, including smartwatches, action cameras, smart glasses, drones, and other products for various scenarios. Furthermore, the company's core executives come from top international manufacturers such as Texas Instruments, NXP Semiconductors, and HUA HONG SEMI, which demonstrates their profound industry experience. Fourier Semiconductor has received strong support from top investors and leading capital markets, including Shunwei Capital led by Lei Jun, founder of Xiaomi Group, Wentianxia Capital led by Zhang Xuezheng, founder of Wingtech Group, technology investment platforms such as Shanghai Mochin under Huaqin Technology, and industry investment partners like Gan Sheng under Rinking Investment Management, Shenzhen Zhanxiang under Transsion Group, as well as top venture capital institutions like the National Integrated Circuit Industry Investment Fund's Beyond Moore Fund and Dacheng Cai Zhi. The debut public offering investment totaled up to 671 million RMB, enabling Fourier Semiconductor to access core industry resources and technological empowerment, while also binding with top customers, securing long-term orders, and injecting strong momentum for the company's long-term development. In terms of financial data, Fourier Semiconductor's total revenue for 2022, 2023, and 2024 is projected to be 130 million, 150 million, and 355 million RMB, respectively. The total revenue in 2024 is expected to grow by approximately 136.34% compared to 2023, showcasing explosive growth momentum. Among domestic mainstream audio chip manufacturers, its AI audio chip compound growth rate ranks first. Portable audio chips contribute to over 90% of revenue and serve as the core pillar of performance growth. Through the listing hearing on the Hong Kong Stock Exchange, the company will leverage the power of the capital markets to promote the localization, commercialization, and globalization of AI audio chips and haptic feedback chips, exploring the scalability of perceptual intelligent chips in more human-machine interaction scenarios.