CSRC approved the IPO registration of Shenghe Jingwei Microtechnology Innovation Board.

On March 5th, the China Securities Regulatory Commission issued the approval for the initial public offering of Shenghe Jingwei Semiconductor Co., Ltd. It is reported that Shenghe Jingwei plans to go public on the Shanghai Stock Exchange's Sci-Tech Innovation Board, with China International Capital Corporation Limited as its sponsoring institution, aiming to raise 4.8 billion yuan. According to the prospectus, Shenghe Jingwei is a leading global integrated circuit wafer-level advanced packaging and testing company, starting with advanced 12-inch mid-stage silicon wafer processing, and further providing full-process advanced packaging and testing services such as wafer-level packaging (WLP) and chip multi-chip integration packaging, dedicated to supporting various high-performance chips, especially graphics processors (GPU), central processors (CPU), artificial intelligence chips, etc., through heterogeneous integration beyond Moore's Law, achieving comprehensive performance improvements in high computing power, high bandwidth, low power consumption, etc.