Cherry Crystal Microtech submitted its registration for the Innovation Board IPO, boasting the largest 12-inch Bumping production capacity in mainland China.

On February 25th, ShengHejingWei Semiconductor Co., Ltd. (referred to as ShengHejing Wei) applied for a change in the IPO review status on the Shanghai Stock Exchange Sci-Tech Board to "registration submitted." China International Finance Co., Ltd. is its sponsor institution, with plans to raise 4.8 billion yuan. According to the prospectus, ShengHejingWei is a global leader in integrated circuit wafer-level advanced packaging services, starting with advanced 12-inch slice processing and further providing full-process advanced packaging services such as wafer-level packaging (WLP) and chip multi-chip integration to support various high-performance chips, especially graphics processors (GPU), central processors (CPU), artificial intelligence chips, etc., achieving comprehensive performance improvement in high computing power, high bandwidth, and low power consumption through heterogenous integration beyond Moore's Law. Since the beginning of its operations, the company has adopted advanced manufacturing and management systems in the front-end wafer manufacturing process and identified chip multi-chip integration packaging as the company's development direction and goal. Currently, the company has become one of the earliest, most technologically advanced, largest in production scale, and most well-established enterprises in chip multi-chip integration packaging in mainland China, with the ability to catch up with the world's leading enterprises in these frontier fields. In the field of mid-end wafer processing, the company is one of the earliest to conduct and realize mass production of 12-inch bumping in mainland China and the first to provide 14nm bumping services, filling the gap in the high-end integrated circuit manufacturing industry chain in mainland China. Subsequently, the company has successively broken through the high-density bumping technology of several more advanced process nodes, entering the international advanced node integrated circuit manufacturing industry chain. According to statistics from Torch Insight Consultancy, by the end of 2024, the company had the largest 12-inch bumping production capacity in mainland China. In the field of wafer-level packaging, based on leading mid-end silicon processing capabilities, the company quickly realized the research and industrialization of 12-inch large wafer-level chip packaging (wafer-level fan-in packaging, WLCSP), including 12-inch Low-K WLCSP suitable for more advanced technology nodes and ultra-thin chip WLCSP with rapid market growth. According to Torch Insight Consultancy's statistics, in 2024, the company ranked first in mainland China in terms of 12-inch WLCSP revenue scale, with a market share of around 31%. In the field of chip multi-chip integration packaging, the company has a technology platform layout that can fully compete with the world's leading enterprises, especially in the mainstream field of 2.5D integration based on silicon through-hole interposers (TSV Interposer). The company is one of the earliest to achieve mass production and has the largest production scale in mainland China, representing the most advanced level in this technology field in mainland China, with no technological gap compared to the world's leading enterprises. According to Torch Insight Consultancy's statistics, in 2024, the company ranked first in mainland China in terms of 2.5D revenue scale, with a market share of around 85%. Additionally, the company is continuously enriching and improving its 3D integration (3DIC), three-dimensional packaging (3D Package), and other technology platforms to achieve breakthroughs in more advanced key technology areas in the integrated circuit manufacturing industry and create new growth points for future business performance. The company can provide one-stop customized integrated circuit advanced packaging services for a variety of chips, including high-performance computing chips, smartphone application processors, RF chips, memory chips, power management chips, fingerprint recognition chips, and network communication chips, application in high-performance computing, artificial intelligence, data centers, autonomous driving, smartphones, consumer electronics, 5G communications, and other terminal fields, deeply participating in China's digitization, informatization, networking, and intelligent construction. In terms of performance, in the fiscal years of 2022, 2023, 2024, and January-June 2025, the company achieved operating income of approximately 1.633 billion yuan, 3.038 billion yuan, 4.705 billion yuan, and 3.178 billion yuan respectively. During the same period, the net profit was approximately -329 million yuan, 34.1306 million yuan, 214 million yuan, and 435 million yuan respectively.