Shenghe Jingwei's Science and Technology Innovation Board IPO has been approved by the Listing Committee, aiming to raise 4.8 billion yuan.

On February 24th, Shenghejingwei Semiconductor Co., Ltd. (referred to as Shenghejingwei) passed the listing committee meeting of the Shanghai Stock Exchange Sci-tech Innovation Board. CICC is its sponsor institution, with a planned fundraising of 4.8 billion RMB. According to the prospectus, Shenghejingwei is a leading global integrated circuit wafer-level advanced packaging company, starting with advanced 12-inch mid-stage silicon processing, and further providing full-process advanced packaging services such as wafer-level packaging (WLP) and chip multi-chip integration packaging, dedicated to supporting various high-performance chips, especially graphics processors (GPU), central processors (CPU), artificial intelligence chips, etc. The company's main revenue comes from chip multi-chip integration packaging, mid-stage silicon processing, and wafer-level packaging. In the field of chip multi-chip integration packaging, the company has a technology platform layout that can benchmark the world's most leading enterprises comprehensively, especially for the most mainstream 2.5D integration based on silicon through-silicon vias (TSV Interposer). It is one of the earliest mass-production enterprises in mainland China. According to Zhoushi Consulting's statistics, in 2024, the company ranked first in mainland China in terms of 2.5D revenue scale, with a market share of approximately 85%. In the field of mid-stage silicon processing, the company is one of the earliest enterprises in mainland China to carry out and achieve mass production of 12-inch bump manufacturing, and the first enterprise to provide 14nm advanced process Bumping services. It fills the gap in mainland China's high-end integrated circuit manufacturing industry chain. According to Zhoushi Consulting's statistics, as of the end of 2024, the company has the largest 12-inch Bumping production capacity in mainland China. The funds raised in this issuance, after deducting issuance expenses, will be invested in the following projects: Financially, in the fiscal years of 2022, 2023, 2024, and January-June 2025, the company achieved operating revenues of approximately 1.633 billion RMB, 3.038 billion RMB, 4.705 billion RMB, and 3.178 billion RMB, respectively. During the same period, the net profits were approximately -329 million RMB, 34.13 million RMB, 2.14 billion RMB, and 4.35 billion RMB, respectively.