The Torrance SME IPO has been accepted, and multiple products have entered the supply systems of clients such as NAURA Technology Group and Advanced Micro-Fabrication Equipment Inc. China.

date
19:16 23/12/2025
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GMT Eight
On December 23, Torrance Precision Manufacturing (Jiangsu) Co., Ltd. (referred to as Torrance) has had its IPO on the Shenzhen Stock Exchange ChiNext board accepted. China International Capital Corporation Limited is its sponsor institution, and it plans to raise 1.15616 billion yuan.
On December 23, Torrance Precision Manufacturing (Jiangsu) Co., Ltd. (referred to as Torrance) IPO on the ChiNext Board of the Shenzhen Stock Exchange has been accepted. China International Finance Co., Ltd. is the sponsor institution for the company, with plans to raise 1.1616 billion yuan. According to the prospectus, the company is a leading comprehensive service provider in the research and development, production, and sales of precision metal components in China. It is dedicated to providing high-performance key process components, process components, structural components, gas pipelines, and system assembly products for semiconductor equipment. Additionally, the company's technological capabilities also cover the laser equipment field, providing laser cavities and cooling process component products required by high-power laser devices. In terms of product types, the company has established a unique competitive advantage with its multi-category semiconductor equipment metal component products. In the production of key process components for semiconductors that require high levels of technology and craftsmanship, the company not only mass-produces key process components such as cavities, liners, heaters, and gas distribution discs but also successfully produces key process components with complex structures such as cold discs, multi-channel heating reflectors, gas distribution discs, and electrostatic chuck bases. Furthermore, the company's product applications have expanded to the field of high-power laser equipment, providing core components such as laser cavities, demonstrating strong inter-domain technical reuse capabilities. In terms of technological and process capabilities, the company's overall technological level ranks among the top tier of domestic manufacturers. Its core technologies comprehensively cover high-precision mechanical manufacturing, welding, and surface treatment, and it has further developed capabilities for integrating and testing complex precision component processes. In terms of welding, relying on long-term collaborative development and technical iteration with leading customers, the company's diversified welding processes, represented by vacuum brazing, are domestically leading. It excels in composite brazing with multiple layers, multi-channel structures, and different materials, meeting the stringent requirements for precision, cleanliness, and reliability of complex precision components. In surface treatment and mechanical processing, the company uses advanced processes such as anodic oxidation and semiconductor-grade high-cleanliness cleaning, combined with high-precision machining technologies such as precision machining of complex structural components and precise manufacturing of micro-holes, collectively ensuring that key components meet industry-leading levels in corrosion resistance, dimensional accuracy, surface cleanliness, and sealing. Based on the aforementioned core technologies, the company has achieved integrated delivery from process design, manufacturing to multidimensional testing and verification. This complex precision component process integration and testing capability has been highly recognized by leading domestic semiconductor equipment manufacturers, fully supporting the demand for high-performance complex precision components for semiconductor equipment. In terms of customers, the company provides deep services to local semiconductor equipment manufacturers, and multiple products have entered the supply chains of customers such as NAURA Technology Group, Advanced Micro-Fabrication Equipment Inc. China, and are applied in etching equipment, thin film deposition equipment, polishing equipment, annealing equipment, etc., covering fields like logic chip processing equipment, memory chip processing equipment, and advanced packaging. Additionally, the company has successfully introduced the supply chain of the international renowned laser equipment company Lumentum, showcasing the international competitiveness of the company's technology. The company's planned public offering this time does not exceed 46,368,423 shares, with a minimum of 25% of the total share capital after the offering. The total amount of funds raised in this offering will depend on the issue price, and all funds raised will be used for the following projects: Financially, in the fiscal years 2022, 2023, 2024, and January-June 2025, the company is expected to achieve operating revenues of approximately 283 million yuan, 291 million yuan, 610 million yuan, and 373 million yuan respectively. During the same period, the net profits are expected to be approximately 33.9453 million yuan, 15.3047 million yuan, 106 million yuan, and 60.8523 million yuan respectively.