Samsung has completed the development of the sixth generation HBM4 chip and sent samples to NVIDIA for initial production approval.

Samsung Electronics has completed the development of its sixth-generation High Bandwidth Memory (HBM4) chip and is now entering the mass production preparation phase. The South Korean tech giant is currently sending HBM4 prototype samples to NVIDIA Corporation (NVDA.US) for quality testing. Samsung's goal is to complete the development of HBM4 by the end of the year, and once it passes NVIDIA Corporation's quality testing, mass production could begin immediately. It is reported that Samsung is also setting up a system for immediate mass production. It is understood that Samsung has completed the "production readiness approval" stage for HBM4, which is the sixth step in the semiconductor development process and the final step before mass production approval. Since successfully developing the sixth-generation 10-nanometer DRAM ("D1c") in June of this year, the company's progress in HBM4 development has accelerated. Samsung plans to regain a competitive advantage by leveraging the higher performance of HBM4 with the D1c, the predecessor. In its third-quarter earnings report, Samsung stated that HBM4 samples are being sent to key customers. Additionally, the company stated that looking ahead to 2026, its memory business will focus on mass producing HBM4 products with differentiated performance. In September of this year, Samsung's competitor SK Hynix stated that it has completed the development of the next-generation memory product HBM4, which is crucial for artificial intelligence work, and is ready for mass production. SK Hynix is a major supplier of HBM chips to NVIDIA Corporation. Micron Technology, Inc. (MU.US) is also a competitor to these two South Korean companies in this field, albeit to a lesser extent.