CSRC approves Yooxun's IPO registration on the Shanghai Stock Exchange
According to reports, Youxun Corporation plans to list on the Shanghai Stock Exchange's Science and Technology Innovation Board, with CITIC Securities as its sponsor institution, intending to raise 809.065 million yuan.
On October 24th, the China Securities Regulatory Commission issued the "Approval for the Initial Public Offering of Shares of Xiamen Yuxun Chip Co., Ltd." It is reported that Yuxun shares plan to be listed on the Shanghai Stock Exchange's Sci-Tech innovation board, with CITIC SEC as its sponsor institution, planning to raise 809.065 million yuan.
The prospectus shows that Yuxun shares, as a "national manufacturing single-item champion enterprise" in the domestic optical communication field, focus on the research, design, and sales of optical communication front-end transceiver chips. The company's products are widely used in optical modules (including optical transceiver components, optical modules, and optical terminals), with applications covering access networks, 4G/5G/5G-A wireless networks, data centers, metropolitan area networks, and backbone networks.
Since its establishment, Yuxun shares have established a complete core technology system in the field of optical communication chip design, achieving technological breakthroughs in key areas such as integrated transmitters and receivers, high-speed modulation, and optoelectronic collaboration. The company adheres to positive design, with deep sub-micron CMOS, germanium-silicon Bi-CMOS dual-process design and integrated research and development capabilities, mastering a full set of bandwidth expansion, impedance matching, signal integrity compensation, and other technologies. Currently, the company has achieved mass shipments of optical communication chip products with speeds ranging from 155Mbps to 100Gbps, and is actively developing a series of new products including 50G PON transceiver chips, 400Gbps and 800Gbps data center transceiver chips, 4-channel 128Gbaud coherent transceiver chips, FMCW (Frequency Modulated Continuous Wave) lidar front-end electric chips, and vehicle-mounted optical communication chips.
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