Angewei Micro's application for an IPO on the Science and Technology Innovation Board was approved at the listing committee meeting. In 2024, its global market share for low-power IoT wireless connectivity chips is approximately 5.4%.

On October 15th, Beijing Anges Microelectronics Technology Co., Ltd. (referred to as Anges Micro) passed the listing committee meeting of the Shanghai Stock Exchange's Sci-Tech Innovation Board. The sponsor for this IPO is China Securities Co., Ltd., aiming to raise 2.067 billion yuan. According to the prospectus, Anges Micro is an integrated circuit design company specializing in the RF and analog fields. It is a national-level key "small giant" enterprise. The company is mainly engaged in the research, design, and sales of RF front-end chips, RF SoC chips, and other analog chips. Since its establishment, the company has continuously invested in research and development and accumulated technology to provide customers with high-performance, high-reliability, low-power consumption, and high-integration RF and analog chip products through efficient product iteration. During the reporting period, the company's core product line mainly includes a full range of RF front-end chip products for intelligent mobile terminals (including RF front-end modules and power amplifiers, RF switches, LNAs, etc.) and RF SoC chip products for the Internet of Things (including low-power Bluetooth and 2.4GHz proprietary protocol wireless communication chips). With excellent technical strength, product performance, and customer service capabilities, the company has accumulated rich customer resources and established a good reputation in the market. The company's RF front-end chip products have been sold on a large scale to well-known terminal customers such as Honor, Samsung, vivo, Xiaomi, OPPO, Lenovo (moto), Transsion, realme, and others. At the same time, the RF SoC chip products have been introduced to well-known industrial, medical, and Internet of Things customers such as Alibaba, Pinduoduo, Xiaomi, Lenovo, Customer C, Customer D, BYD Company Limited, Jiuhao, Tailin, Hanscho, Sannuo Medical, Kaidishi, Guangzhou Wahlap Technology Corporation, HP, Customer G, RemoteSolution. With rich technical accumulation and outstanding technical innovation capabilities, as of the end of the reporting period, the company has led or participated in 6 national-level and multiple local-level major scientific research projects. While actively promoting the basic research and industrial application of the RF field in China, the company has developed high-integration products such as 5GL-PAMiD. The technical solutions and performance of this product have reached the level of international manufacturers and have been mass-produced and applied in mainstream brand flagship models, breaking the monopoly of international manufacturers on L-PAMiD module products. According to data from the Bluetooth SIG, the global shipments of low-power Bluetooth devices are estimated to be around 1.8 billion units by 2024. Since a single Bluetooth device generally carries a single RF Bluetooth SoC chip, combined with the company's estimated shipments of 98 million low-power Bluetooth SoC chips in 2024, the company's global market share in the low-power Internet of Things wireless connectivity chip field in 2024 is estimated to be around 5.4%. In terms of finance, the company achieved operating income of approximately 923 million yuan in 2022, 1.695 billion yuan in 2023, 2.101 billion yuan in 2024, and 844 million yuan in the first half of 2025. Meanwhile, the company's net profits were approximately -290 million yuan, -450 million yuan, -64.7092 million yuan, and -40.2995 million yuan during the same period.