HK Stock Market Move | SICC Co., Ltd. (02631) rose more than 8%, and silicon carbide became the new route for chip cooling. The company is a leading enterprise in silicon carbide substrates.

SICC Co., Ltd. (02631) rose more than 8%, up 8.05% to HK$65.8 as of the time of the announcement, with a turnover of HK$1.15 billion. In terms of news, Huawei recently published two patents related to silicon carbide heat dissipation, including "Thermal Conductive Composition and Its Preparation Method and Application" and "Thermal Conductive Absorption Composition and Its Application". Both patents use silicon carbide as a filler to enhance the thermal conductivity of electronic devices. The former is applied in the heat dissipation of electronic components and packaging chips (substrates, heat spreaders), while the latter is used in electronic components and circuit boards. Previously, there were reports that NVIDIA changed the intermediate substrate material of its new Rubin processor design from silicon to silicon carbide in CoWoS advanced packaging to enhance heat dissipation performance, and is expected to be widely adopted starting in 2027. SICC Co., Ltd. previously stated that the company continues to layout in forward-looking technological innovation, in addition to supplying silicon carbide substrate materials for power devices and RF devices, the company has also extensively laid out silicon carbide products and technologies in emerging areas such as optical waveguides, TF-SAW filters, and heat dissipation components. Orient previously pointed out that silicon carbide has excellent thermal conductivity and is expected to be applied in intermediary layers, heat dissipation substrates, and other areas, with related manufacturers expected to benefit. Relevant targets include the silicon carbide substrate industry leader SICC Co., Ltd. and others.