United Microelectronics Corp. Sponsored ADR (UMC.US) plans to deploy advanced packaging for 6nm technology?

United Microelectronics Corp. Sponsored ADR announced a consolidated revenue of NT$18.823 billion in June, a decrease of 3.37% compared to the previous month but still a year-on-year growth of 7.26%. The second-quarter consolidated revenue increased slightly by 1.55% compared to the previous quarter, meeting the company's expectations. Amid intense competition in mature processes, there are rumors in the market that United Microelectronics Corp. Sponsored ADR may gradually shift towards advanced processes. The company, however, stated its focus on strengthening advanced packaging and customized production capacity to adapt to market changes and competition. The article also mentioned the potential expansion of United Microelectronics Corp. Sponsored ADR's collaboration with Intel Corporation to upgrade the production process to 6nm. The company is also exploring new business opportunities such as advanced packaging to enhance its long-term competitiveness. United Microelectronics Corp. Sponsored ADR emphasized its commitment to developing a comprehensive advanced packaging solution and integrating wafer manufacturing and packaging to offer a more complete service system. Despite the market rumors, the company's strategic move into the advanced packaging sector is seen as a way to boost its competitive edge and move away from price competition.