Electric Blue Sky and Red Board Technology's application for IPO on the Shanghai Stock Exchange has been accepted.

On June 28th, China Electronics Technology Group Corporation Blue Sky Technology Co., Ltd. (referred to as CETC Blue Sky) submitted its application for an IPO on the Sci-Tech Innovation Board of the Shanghai Stock Exchange. China Securities Co., Ltd. is the sponsor institution, aiming to raise 1.5 billion RMB. On the same day, Jiangxi Hongban Technology Co., Ltd. (referred to as Hongban Technology) also submitted its application for an IPO on the main board of the Shanghai Stock Exchange. Minsheng Securities is the sponsor institution, aiming to raise 2.057 billion RMB. According to the prospectus, CETC Blue Sky is mainly engaged in the research, development, production, sales, and services of electric energy products and systems. They provide a complete set of solutions for power generation, energy storage, control, and system integration, with their products covering a wide range of applications from deep sea (1 kilometer underwater) to deep space (2.25 billion kilometers from Earth). The company's main business includes aerospace power, special power, new energy applications, and services. The aerospace power products developed by the company have a long history, starting from providing power products for China's first artificial satellite "Dongfanghong-1" in 1970. They have since provided high-quality and reliable power products for over 700 satellites/spaceships/probes/space stations including Shenzhou spacecraft, Tiangong space station, Beidou satellites, Chang'e lunar probes, Tianwen Mars probes, Gaofen satellites, among others, playing a crucial role in China's aerospace achievements. Hongban Technology focuses on the research, production, and sales of printed circuit boards, targeting the middle-to-high end application market. Their products are characterized by high precision, high density, and high reliability, with a significant share of HDI boards in the industry and the ability to mass produce any interconnected HDI boards and IC carrier boards. The company has a complete product structure, including HDI boards, rigid boards, flexible boards, rigid-flex boards, IC carrier boards, etc., with comprehensive technical research and production capabilities, offering customers a variety of product choices and one-stop services. Their products are widely used in consumer electronics, automotive electronics, high-end displays, communication electronics, etc., with a significant competitive advantage and market position in the consumer electronics and automotive electronics sectors.