New Stock News | Howei Integration Submits Application to Hong Kong Stock Exchange as a Fabless Semiconductor Company Mainly Engaged in Three Product Lines Including Image Sensor Solutions

According to the disclosure of the Hong Kong Stock Exchange on June 27, Howe Technology Integrated Circuits (Group) Co., Ltd. (referred to as Howe Technology Integrated) has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with UBS, CICC, PASCHK, and GFSHK as joint sponsors. According to the prospectus, based on data from Frost & Sullivan, by 2024, Howe Technology Integrated is one of the top ten Fabless semiconductor companies globally in terms of revenue. According to Frost & Sullivan data, in terms of revenue from image sensor solutions in 2024, the company is the third largest digital image sensor supplier globally. Currently, Howe Technology Integrated is mainly engaged in three product lines: image sensor solutions, display solutions, and analog solutions, and is continuously expanding its product and solution categories and coverage to serve high-growth industries such as smartphones, automobiles, medical, security, and emerging markets (machine vision, smart glasses, and edge AI). The company is one of the few globally to have a comprehensive product line and strong design capabilities among IC design companies, enabling it to design, develop, and sell a variety of high-performance, highly integrated semiconductor solutions widely used in various key industries. As the company advances technology development, increases technological complexity, and integrates more deeply with specific application solutions, it can provide a diverse combination of image sensors, display products, analog ICs, and other semiconductor components. With strong design capabilities and collaboration with third-party foundries in the three core business lines, the company continues to expand the coverage of cutting-edge semiconductor products to meet the needs of various end markets such as automotive, smartphones, and more. In terms of image sensor solutions, the company offers a variety of image sensor solutions, including CIS, Micro Image Module Package (CameraCubeChip), LCOS, and ASIC products. These solutions serve end customers in various industries such as consumer electronics, automotive, medical, security, and emerging markets (machine vision, smart glasses, and edge AI). In terms of display solutions, the company provides a wide range of display driver products, including LCD-TDDI, OLED DDIC, and TED (Integrated Display Driver Chips), which are widely used in smartphones and PCs. The company also continues to invest in developing automotive display driver solutions and launching automotive TDDI products that meet mainstream market requirements. Financially, in the fiscal years 2022, 2023, and 2024, Howe Technology Integrated achieved revenues of approximately RMB 20.04 billion, RMB 20.984 billion, and RMB 25.707 billion respectively; and profits of RMB 951 million, RMB 544 million, and RMB 3.279 billion respectively for the same periods.