New stock information | Chuangzhi Xinlian submitted an application to the Hong Kong Stock Exchange to provide solutions for coating materials and key process technology.
On June 9th, the Hong Kong Stock Exchange disclosed that Shenzhen Chuangzhi Xinlian Technology Co., Ltd. has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with Haitong International, Bank of China International, and CMB International as its joint sponsors.
According to the disclosure of the Hong Kong Stock Exchange on June 9, Shenzhen Chuangzhi Xinlian Technology Co., Ltd. (Chuangzhi Xinlian) has submitted a listing application to the main board of the Hong Kong Stock Exchange, with HAITONG INT'L, CICC International, and CMSC International as its joint sponsors.
The prospectus shows that Chuangzhi Xinlian is a provider of metal interconnect plating materials and key process technology solutions, dedicated to advancing wafer-level and chip-level packaging, as well as the development of plating material supply chain in the PCB manufacturing field. The company has developed a complete matrix of chemical plating and electroplating materials products, covering applications in wafer-level packaging, chip-level packaging, and PCB manufacturing.
According to Frost & Sullivan data, based on the revenue calculation in 2024, the company is the largest domestic wet process plating material provider in the Chinese market, as well as the largest one-stop plating solution provider in the Chinese market.
The company's revenue mainly comes from the plating material business and plating service business included in the one-stop service solution. The plating material business is the company's main business, generating revenue through the manufacturing and sale of plating materials for semiconductor and PCB industries.
The company's plating materials and services cover two core plating processes in the electronic packaging field of the semiconductor and PCB industries: chemical plating and electroplating. Specifically, the main products include chemical nickel gold/chemical nickel palladium gold, electroplated copper, and cyanide-free electroplated gold plating materials.
In terms of plating service business, when managing this business unit, the company provides plating services for silicon wafers, silicon carbide wafers, packaging substrates, and PCBs to customers and charges service fees.
The synergy of the two major business segments strengthens the company's influence in the industry ecosystem. Specifically, the company can supplement customers' production capacity by undertaking standard and stringent production batches, as well as enhance its research and development system by undertaking key tasks such as innovative process development verification and engineering batch flow pieces, thus continuously strengthening its influence in the industry ecosystem.
In terms of performance, in the fiscal years 2022, 2023, and 2024, Chuangzhi Xinlian achieved revenues of approximately RMB 320 million, RMB 312 million, and RMB 410 million respectively; and profits for the same period were RMB 27.328 million, RMB 19.421 million, and RMB 52.706 million respectively.
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