New Stock News | Hua Hui Optoelectronics (688538.SH) and others plan to list on the Hong Kong IPO have already submitted materials to the China Securities Regulatory Commission.

On May 16, the China Securities Regulatory Commission released a table showing the situation of domestic companies issuing securities overseas and applying for listing (initial public offering and full circulation) as of May 16, 2025. This week (May 12-16), Hu Hui Electronics (688538.SH), CNGR Advanced Material (300919.SZ), and Fibocom Wireless Inc. (300638.SZ) have submitted materials for Hong Kong IPO to the China Securities Regulatory Commission. According to the Hong Kong Stock Exchange disclosed on April 23, Shanghai Hu Hui North Electro-Optics Co., Ltd. (referred to as Hu Hui Electronics (688538.SH)) has submitted to the Hong Kong Stock Exchange main board, with CICC as the sole sponsor. The prospectus shows that Hu Hui Electronics is the world's leading manufacturer of AMOLED semiconductor display panels, specializing in research and production of AMOLED semiconductor display panels that provide extraordinary true colors, outstanding visual experience, and low power consumption for people. According to market research consultancy, based on cumulative sales from 2022 to 2024, the company ranks second in the world among large-sized AMOLED semiconductor display panel manufacturers, and first in China. According to the Hong Kong Stock Exchange disclosed on April 22, CNGR Advanced Material (300919.SZ) has submitted to the Hong Kong Stock Exchange main board, with Morgan Stanley and Huatai International as its joint sponsors. According to the prospectus, CNGR Advanced Material is an innovative new energy material company. Since 2020, the company has been the leader in global shipments of nickel-based and cobalt-based lithium-ion battery cathode active material precursors (pCAM) for five consecutive years, and in the first quarter of 2025, CNGR Advanced Material is also the leading supplier of phosphorus-based pCAM in the global export market. According to the Hong Kong Stock Exchange disclosed on April 25, Shenzhen Fibocom Wireless Inc. Wireless Co., Ltd. (referred to as Fibocom Wireless Inc.) has submitted to the Hong Kong Stock Exchange main board, with CITIC SEC as its exclusive sponsor. According to the prospectus, Fibocom Wireless Inc. is a leading global wireless communication module provider. The company's module products include: (i) data transmission modules, (ii) smart modules, and (iii) AI modules. At the same time, the company, based on its module products, combined with a deep understanding of downstream application scenarios, provides customers with customized solutions, including: (i) end-side AI solutions, (ii) Siasun Robot & Automation solutions, and (iii) other solutions.