Sealand: Advanced packaging materials are expected to see significant development and receive an industry "recommended" rating for the first time.

Sealand releases research report, saying that with the pull of multiple emerging application areas downstream, advanced packaging materials are expected to maintain high growth rates. As a core upstream component of the industry chain, advanced packaging materials are facing a historic opportunity in the current background of accelerating domestic substitution, and are recommended for the first time. The main points of Sealand are as follows: Advanced packaging is expected to see significant development Packaging is a key stage in the semiconductor manufacturing process, and the global packaging industry is steadily increasing in size. Due to the rapid development of downstream high-end consumer electronics, artificial intelligence, data centers, and other applications that heavily rely on advanced packaging, the growth rate of advanced packaging is expected to be significantly faster than traditional packaging in the future. According to Yole, the global advanced packaging market is expected to reach 78.6 billion U.S. dollars by 2028, with a CAGR of 10.6% from 2022 to 2028, far higher than the 3.2% for traditional packaging. It is expected to surpass traditional packaging for the first time in 2025, with a market share of 51% in the global packaging and testing market. There is great potential for domestic substitution in advanced packaging materials In advanced packaging, the definition of "advanced" is relative: the definition of advanced packaging varies in different regions and periods. Generally, any packaging with one of the four basic elements of Bump, RDL, Wafer, and TSV can be considered advanced packaging. Advanced packaging materials include temporary bonding materials, epoxy molding compounds, PSPI, underfill, fillers, wet electronic chemicals, etc. Due to the relatively late start of China's advanced packaging industry and the high technical barriers of advanced packaging materials, most materials have a high concentration in the global market and are mainly monopolized by foreign companies. In the context of the accelerated transfer of global capacity in the integrated circuit and smart terminal industries to China, coupled with considerations such as supply chain security, cost control, and technical support, the process of domestic substitution for advanced packaging materials is expected to accelerate. Risk warning Market demand is lower than expected, intensification of international trade disputes, domestic substitution is lower than expected, rapid technological iteration risks, downstream material verification is lower than expected, recommended targets' performance is lower than expected.