New Stock News | It is rumored that an investment bank is willing to underwrite the Contemporary Amperex Technology's Hong Kong IPO at a financing rate of 0.01%.

Contemporary Amperex Technology (300750.SZ) is considering a secondary listing in Hong Kong. Morgan Stanley estimates that the IPO could raise as much as $7.7 billion, making it one of the largest new listings in Hong Kong in recent years. CICC, China Securities Co., Ltd., Morgan Stanley, and BofA Securities are expected to be the main underwriters. Market sources suggest that Contemporary Amperex Technology originally planned to pay a 0.2% underwriting fee, but some investment banks are willing to accept a fee of 0.01% of the financing amount. It is reported that Contemporary Amperex Technology announced in December last year that, subject to approval at a shareholders' meeting, it plans to complete a listing in Hong Kong within 18 months and intends to appoint a Hong Kong accounting firm as the auditor for the listing. Concerning the size of the offering, Contemporary Amperex Technology has stated that the number of H-shares to be issued in this offering will not exceed 5% of the expanded total share capital and the overall coordinator will be granted up to 15% of over-allotment options.