TechInsights: The semiconductor equipment market will see strong growth next year, with an expected increase of 19.6%.
TechInsights indicates that the semiconductor equipment market will experience strong growth next year, with an expected increase of 19.6%.
TechInsights released the "2025 Semiconductor Manufacturing Market Outlook". TechInsights stated that due to improvements in terminal demand and price increases, IC sales are expected to grow by 26% in 2025. With more devices being sold, IC sales volume is expected to surge by 17%. The semiconductor equipment market is expected to experience robust growth next year, with a projected increase of 19.6%.
Increased investment will support manufacturing capacity expansion
Due to improvements in terminal demand and price increases, IC sales are expected to grow by 26% in 2025. With more devices being sold, IC sales volume is expected to increase by 17%, which will drive a corresponding 17% increase in silicon demand as ICs are the main consumers of silicon. Continuous investment is crucial for supporting this growth and driving technological advancements. Therefore, semiconductor capital expenditures are expected to increase by 14%.
China's high demand will continue to drive equipment sales growth
In 2025, the equipment market is expected to experience strong growth, with a projected increase of 19.6%. This significant increase is mainly driven by China's sustained high demand, as China is expected to continue playing a key role in the market. Equipment companies are confident in China's continued strong influence.
Furthermore, the increase in IC sales volume will also drive higher equipment sales growth. As equipment becomes more complex and advanced, the demand for cutting-edge technological solutions such as hybrid bonding and High-NA lithography will continue to grow.
The increasing importance of advanced packaging in the manufacturing process
In 2025, advanced packaging will continue to be a more important component of the semiconductor manufacturing process, helping to optimize power, performance, and area while reducing costs. AI is driving the demand for larger substrates with more layers and I/O. Glass substrates are a major trend in the packaging field, as they offer better heat stability, mechanical stability, and excellent flatness, which can increase interconnect density to achieve high-density and high-performance packaging for use with AI chips.
Revenue from key subsystems will peak in 2025
2025 will be a key year for the semiconductor and subsystem markets. With AI, interest rate reductions, and consumer replacement cycles all aligning in 2025, industry DRIVE will be fully utilized. These DRIVES are driving more investment in the supply chain, providing support for the subsystem market. Unlike the fragmented market of the past few years, this investment will lead to a 15% growth in a wider range of equipment and subsystem markets in 2025.
The testing market will achieve double-digit growth in 2025
By 2025, the semiconductor testing market (including probe cards, testing and aging sockets, and equipment interface boards) will see significant development. Major driving factors include the growing demand for AI, 5G, and automotive electronic products, leading to more complex and higher density ICs. We expect advanced testing solutions to increase significantly to ensure the reliability and scalability of next-generation nodes.
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