CSRC approves Huangshangu Jie Chuangye Board IPO registration

On November 7th, the China Securities Regulatory Commission issued the "Approval for the Initial Public Offering of Shares by Huangshan Gujie Co., Ltd." It is reported that Huangshan Gujie plans to list on the ChiNext board of the Shenzhen Stock Exchange, with Guoyuan as the IPO sponsor, aiming to raise 502.01 million yuan. According to the prospectus, Huangshan Gujie is a national high-tech enterprise specializing in the research, production, and sale of power semiconductor module heat dissipation substrates. It is a leading enterprise in the field of automotive-grade power semiconductor module heat dissipation substrates. The company's products are mainly used in the field of new energy vehicles, serving as important components in power semiconductor modules for new energy vehicle motor controllers. Additionally, the company's products also have broad application prospects in the fields of new energy generation and energy storage. The company's main products include copper pin heat dissipation substrates and copper flat heat dissipation substrates, both of which are used in the heat dissipation systems of power semiconductor modules. The copper pin heat dissipation substrates are used in the new energy vehicle field, while the copper flat heat dissipation substrates are used in the field of new energy generation.