Huawei Chief Scientist of Semiconductors Liao Heng: Deep collaboration between chips and software to fully leverage the capabilities of super node systems.

Recently, the Huawei Kunpeng Ascend Developer Conference 2026 was held in Beijing. At this conference, Huawei Fellow and Chief Scientist of Semiconductors Liao Heng stated that for various types of business loads such as pre-training, inference, Prefill, and Decode, the four core indicators of AI chips - computing power, memory bandwidth, memory capacity, and interconnect IO bandwidth - have different priorities in different application scenarios. He specifically pointed out that the interconnect capability is sometimes overlooked, but it directly determines the ability of super nodes. By leveraging the excellent interconnect capability of the Ascend 950 chip, it is possible to construct super nodes with higher bandwidth, lower latency, and a broader coverage range. Overall, the system's comprehensive performance is equivalent to the product of the super node scale and the single chip performance specifications.